Satou; Eikichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Satou; Eikichi.The latest application filed is for "method of producing flexible printed-circuit board covered with coverlay".
- Satou; Eikichi - Oyama JP
| Patent | Date |
|---|---|
| Method of producing flexible printed-circuit board covered with coverlay Grant 5,234,522 - Suzuki , et al. August 10, 1 | 1993-08-10 |
| Heat resistant adhesive composition and bonding method using the same Grant 5,089,346 - Imaizumi , et al. February 18, 1 | 1992-02-18 |
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