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name:-0.0082278251647949
name:-0.0089850425720215
name:-0.0015699863433838
Sato; Yoshizumi Patent Filings

Sato; Yoshizumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sato; Yoshizumi.The latest application filed is for "apparatus for manufacturing a wiring board and method for manufacturin a wiring board".

Company Profile
0.7.4
  • Sato; Yoshizumi - Yokohama JP
  • Sato; Yoshizumi - Yokohama-shi JP
  • Sato; Yoshizumi - Tokyo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Apparatus for manufacturing a wiring board
Grant 7,526,859 - Sasaoka , et al. May 5, 2
2009-05-05
Apparatus for manufacturing a wiring board and method for manufacturin a wiring board
App 20070044294 - Sasaoka; Kenji ;   et al.
2007-03-01
Method for manufacturing a wiring board
Grant 7,134,193 - Sasaoka , et al. November 14, 2
2006-11-14
Apparatus for manufacturing a wiring board and method for manufacturing a wiring board
App 20050115068 - Sasaoka, Kenji ;   et al.
2005-06-02
Apparatus for manufacturing a wiring board
Grant 6,865,801 - Sasaoka , et al. March 15, 2
2005-03-15
Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board
App 20020046880 - Takubo, Chiaki ;   et al.
2002-04-25
Hybrid wiring board, semiconductor apparatus, flexible substrate, and fabrication method of hybrid wiring board
Grant 6,329,610 - Takubo , et al. December 11, 2
2001-12-11
Apparatus for manufacturing a wiring board and method for manufacturing a wiring board
App 20010039720 - Sasaoka, Kenji ;   et al.
2001-11-15
Method of manufacturing printed wiring boards
Grant 5,865,934 - Yamamoto , et al. February 2, 1
1999-02-02
Printed wiring board having an interconnection penetrating an insulating layer
Grant 5,736,681 - Yamamoto , et al. April 7, 1
1998-04-07
Wiring boards and manufacturing methods thereof
Grant 5,310,966 - Iida , et al. May 10, 1
1994-05-10

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