| Patent | Date |
|---|
Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board
Grant 11,419,210 - Matsushima , et al. August 16, 2 | 2022-08-16 |
Resin Composition, Copper Foil With Resin, Dielectric Layer, Copper-clad Laminate, Capacitor Element, And Printed Wiring Board With Built-in Capacitor
App 20220162418 - HOSOI; Toshihiro ; et al. | 2022-05-26 |
Semiconductor Package Manufacturing Method
App 20210327847 - NAKAMURA; Toshimi ; et al. | 2021-10-21 |
Semiconductor Package Manufacturing Method, And Adhesive Sheet Used Therein
App 20210327848 - NAKAMURA; Toshimi ; et al. | 2021-10-21 |
Information Processing Device, Information Processing Method, And Program
App 20210268386 - SATO; Tetsuro | 2021-09-02 |
Makeup simulation assistance apparatus, makeup simulation assistance method, and non-transitory computer-readable recording medium storing makeup simulation assistance program
Grant 10,559,102 - Taoka , et al. Feb | 2020-02-11 |
Railcar
Grant 10,538,256 - Sato , et al. Ja | 2020-01-21 |
Multilayer Circuit Board Manufacturing Method
App 20190378727 - MATSUURA; Yoshinori ; et al. | 2019-12-12 |
Multilayer Circuit Board Manufacturing Method
App 20190378728 - MATSUURA; Yoshinori ; et al. | 2019-12-12 |
Railcar
Grant 10,457,297 - Sato , et al. Oc | 2019-10-29 |
Adhesive Sheet And Method For Peeling Same
App 20190292415 - SATO; Tetsuro ; et al. | 2019-09-26 |
Makeup Simulation Assistance Apparatus, Makeup Simulation Assistance Method, And Non-transitory Computer-readable Recording Medium Storing Makeup Simulation Assistance Program
App 20180260983 - TAOKA; HIROKI ; et al. | 2018-09-13 |
Railcar
App 20170334465 - SATO; Tetsuro ; et al. | 2017-11-23 |
Railcar
App 20170327134 - SATO; Tetsuro ; et al. | 2017-11-16 |
Railcar
App 20170327133 - SATO; Tetsuro ; et al. | 2017-11-16 |
Wrinkle care support device and method for supporting wrinkle care
Grant 9,798,921 - Shinoda , et al. October 24, 2 | 2017-10-24 |
Communication light detector
Grant 9,453,762 - Suzuki , et al. September 27, 2 | 2016-09-27 |
Wrinkle Care Support Device And Method For Supporting Wrinkle Care
App 20160154992 - SHINODA; MASAYO ; et al. | 2016-06-02 |
Friction stir welding apparatus comprising slide plates
Grant 9,216,472 - Sato , et al. December 22, 2 | 2015-12-22 |
Transmission apparatus, reception apparatus, communication system, transmission method, and reception method
Grant 9,185,130 - Sato November 10, 2 | 2015-11-10 |
Communication Light Detector
App 20150253182 - SUZUKI; Kanako ; et al. | 2015-09-10 |
Resin Composition, Metal Foil Provided With Resin Layer, Metal Clad Laminate, And Printed Wiring Board
App 20150140296 - Matsushima; Toshifumi ; et al. | 2015-05-21 |
Copper foil with ultra thin adhesive layer, and a method for manufacturing the copper foil with ultra thin adhesive layer
Grant 8,815,387 - Sato , et al. August 26, 2 | 2014-08-26 |
Friction Stir Welding Apparatus
App 20140231490 - Sato; Tetsuro ; et al. | 2014-08-21 |
Transmission Apparatus, Reception Apparatus, Communication System, Transmission Method, And Reception Method
App 20140201523 - Sato; Tetsuro | 2014-07-17 |
Communication Device And Communication Method
App 20140133498 - Sato; Tetsuro ; et al. | 2014-05-15 |
Porous metal foil and production method therefor
Grant 8,497,026 - Matsunaga , et al. July 30, 2 | 2013-07-30 |
Resin composition for forming insulating layer of printed wiring board
Grant 8,431,224 - Sato , et al. April 30, 2 | 2013-04-30 |
Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof
Grant 8,304,091 - Matsunaga , et al. November 6, 2 | 2012-11-06 |
Radio Base Station And Handover Instructing Method
App 20120178455 - SATO; Tetsuro | 2012-07-12 |
Porous Metal Foil And Production Method Therefor
App 20110318600 - Matsunaga; Tetsuhiro ; et al. | 2011-12-29 |
Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board using the same copper foil with insulating layer
Grant 7,927,453 - Sato , et al. April 19, 2 | 2011-04-19 |
Resin Composition For Forming Insulating Layer Of Printed Wiring Board
App 20100108368 - Sato; Tetsuro ; et al. | 2010-05-06 |
Surface-treated Copper Foil, Surface-treated Copper Foil With Very Thin Primer Resin Layer, Method For Manufacturing The Surface-treated Copper Foil, And Method For Manufacturing The Surface-treated Copper Foil With Very Thin Primer Resin Layer
App 20100068511 - Matsunaga; Tetsuhiro ; et al. | 2010-03-18 |
Metal Composite Laminate for Producing Flexible Wiring Board and Flexible Wiring Board
App 20090317591 - Sato; Tetsuro ; et al. | 2009-12-24 |
Multilayered printed wiring board and manufacturing method thereof
Grant 7,485,361 - Nakamura , et al. February 3, 2 | 2009-02-03 |
Flexible Printed Wiring Board and Semiconductor Device
App 20080174016 - Sato; Tetsuro ; et al. | 2008-07-24 |
Electrodeposited Copper Foil with Carrier Foil with a Primer Resin Layer and Manufacturing Method Thereof
App 20080107865 - Matsunaga; Tetsuhiro ; et al. | 2008-05-08 |
Copper Foil with Ultra Thin Adhesive Layer, and a Method for Manufacturing the Copper Foil with Ultra Thin Adhesive Layer
App 20070243402 - Sato; Tetsuro ; et al. | 2007-10-18 |
Multilayered printed wiring board and manufacturing method thereof
App 20070102804 - Nakamura; Kensuke ; et al. | 2007-05-10 |
Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board using the same copper foil with insulating layer
App 20070062640 - Sato; Tetsuro ; et al. | 2007-03-22 |
Method for preparing copper foil with insulating layer and copper foil with insulating layer prepared by the method, and printed wiring board using the copper foil with insulating layer
Grant 7,163,600 - Sato , et al. January 16, 2 | 2007-01-16 |
Prepreg production method and prepeg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method
Grant 7,144,472 - Sato , et al. December 5, 2 | 2006-12-05 |
Resin layer-coated copper foil and multilayer printed wiring board obtained with the resin layered-coated copper foil
App 20060166005 - Sato; Tetsuro ; et al. | 2006-07-27 |
Bit string check method and device
App 20060059196 - Sato; Tetsuro ; et al. | 2006-03-16 |
Dielectric Filler Containing Resin For Use In Formation Of Built-in Capacitor Layer Of Printed Wiring Board And Double-sided Copper Clad Laminate With Dielectric Layer Formed Using The Same Dielectric Filler Containing Resin, And Production Method Of Double-sided Copper Clad Laminate
Grant 6,905,757 - Matsushima , et al. June 14, 2 | 2005-06-14 |
Resin-coated copper foil, and printed wiring board using resin-coated copper foil
Grant 6,831,129 - Sato , et al. December 14, 2 | 2004-12-14 |
Method for preparing copper foil with insulating layer and cooper foil with insulating layer prepared by the method, and printed wiring board using the cooper foil with insulating layer
App 20040188134 - Sato, Tetsuro ; et al. | 2004-09-30 |
Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler, and process for producing copper double clad laminate
App 20040147658 - Matsushima, Toshifumi ; et al. | 2004-07-29 |
Double-sided copper clad laminate and method for manufacturing the same
App 20040101696 - Yamazaki, Kazuhiro ; et al. | 2004-05-27 |
Flexbeam
Grant 6,739,834 - Mochida , et al. May 25, 2 | 2004-05-25 |
Resin Compound For Fabricating Interlayer Dielectric Of Printed Wiring Board, Resin Sheet And Resin Applied-copper Foil For Forming Insulation Layer Using The Resin Compound, And Copper-clad Laminate Using Them
Grant 6,716,530 - Sato , et al. April 6, 2 | 2004-04-06 |
Prepreg production method and prepeg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method
App 20040062858 - Sato, Tetsuro ; et al. | 2004-04-01 |
Resin-coated composite foil, production and use thereof
Grant 6,652,962 - Sato , et al. November 25, 2 | 2003-11-25 |
High temperature superconductor Josephson junction element and manufacturing method for the same
App 20030146432 - Sato, Tetsuro ; et al. | 2003-08-07 |
Flexbeam
App 20030086786 - Mochida, Tomomi ; et al. | 2003-05-08 |
Resin-coated copper foil, and printed wiring board using resin-coated copper foil
App 20030087101 - Sato, Tetsuro ; et al. | 2003-05-08 |
Resin compound for fabricating interlayer dielectric of printed wiring board, resin sheet and resin applied-copper foil for forming insulating layer using the resin compound, and copper-clad laminate using them
App 20020106516 - Sato, Tetsuro ; et al. | 2002-08-08 |
Videotext communication network with a receiving terminal that automatically preforms operations to network responsive to predetermined schedule
Grant 5,218,708 - Kanbayashi , et al. June 8, 1 | 1993-06-08 |
Retaining structure of brush spring of electric motor
Grant 5,053,665 - Yamaguchi , et al. October 1, 1 | 1991-10-01 |
System for damping lead-lag motion of rotor blades of helicopter
Grant 4,893,988 - Sato January 16, 1 | 1990-01-16 |
Method of the production of immunoglobulin having high content of monomer
Grant 4,384,993 - Sato , et al. May 24, 1 | 1983-05-24 |
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