Sato; Daryl A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sato; Daryl A..The latest application filed is for "power-ground plane partitioning and via connection to utilize channel/trenches for power delivery".

Company Profile

0.18.18

Sato; Daryl A. - Beaverton OR
Sato; Daryl A - Portland OR
Sato; Daryl A. - Portland OR
Sato, Daryl A. - Portalnd OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery Grant 8,299,369 - Brist , et al. October 30, 2	2012-10-30
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery Grant 8,056,221 - Brist , et al. November 15, 2	2011-11-15
Method of power-ground plane partitioning to utilize channel/trenches Grant 7,797,826 - Brist , et al. September 21, 2	2010-09-21
Power-Ground Plane Partitioning and Via Connection to Utilize Channel/Trenches for Power Delivery App 20100038127 - Brist; Gary A. ; et al.	2010-02-18
Apparatus for providing an integrated printed circuit board registration coupon Grant 7,583,513 - Boggs , et al. September 1, 2	2009-09-01
Electronic packaging using conductive interproser connector Grant 7,385,288 - Boggs , et al. June 10, 2	2008-06-10
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery App 20080029295 - Brist; Gary A. ; et al.	2008-02-07
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery App 20080029296 - Brist; Gary A. ; et al.	2008-02-07
Three-dimensional flexible interposer Grant 7,325,303 - Boggs , et al. February 5, 2	2008-02-05
Electronic Packaging Using Conductive Interproser Connector App 20070228562 - Boggs; David W. ; et al.	2007-10-04
Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power delivery Grant 7,269,899 - Brist , et al. September 18, 2	2007-09-18
Electronic packaging using conductive interposer connector Grant 7,241,680 - Boggs , et al. July 10, 2	2007-07-10
Three-dimensional flexible interposer App 20070082512 - Boggs; David W. ; et al.	2007-04-12
Three-dimensional flexible interposer Grant 7,201,583 - Boggs , et al. April 10, 2	2007-04-10
Photo-thermal induced diffusion Grant 7,145,243 - Brist , et al. December 5, 2	2006-12-05
PCB method and apparatus for producing landless interconnects Grant 7,084,354 - Boggs , et al. August 1, 2	2006-08-01
Photo-thermal induced diffusion Grant 7,064,063 - Brist , et al. June 20, 2	2006-06-20
Electronic packaging using conductive interposer connector App 20050242434 - Boggs, David W. ; et al.	2005-11-03
Standoff devices and methods of using same Grant 6,941,537 - Jessep , et al. September 6, 2	2005-09-06
Three-dimensional Flexible Interposer App 20050142900 - Boggs, David W. ; et al.	2005-06-30
Method and apparatus for providing an integrated printed circuit board registration coupon App 20050063166 - Boggs, David W. ; et al.	2005-03-24
PCB design and method for providing vented blind vias App 20040231886 - Boggs, David W. ; et al.	2004-11-25
Electronic substrate with direct inner layer component interconnection App 20040219342 - Boggs, David W. ; et al.	2004-11-04
PCB design and method for providing vented blind vias Grant 6,787,443 - Boggs , et al. September 7, 2	2004-09-07
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery Grant 6,747,216 - Brist , et al. June 8, 2	2004-06-08
Photo-thermal induced diffusion App 20040058561 - Brist, Gary A. ; et al.	2004-03-25
Photo-thermal induced diffusion App 20040058521 - Brist, Gary A. ; et al.	2004-03-25
Coupon registration mechanism and method Grant 6,667,090 - Boggs , et al. December 23, 2	2003-12-23
PCB method and apparatus for producing landless interconnects App 20030231474 - Boggs, David W. ; et al.	2003-12-18
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery App 20030205407 - Brist, Gary A. ; et al.	2003-11-06
Photo-thermal induced diffusion Grant 6,642,158 - Brist , et al. November 4, 2	2003-11-04
Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery App 20030146020 - Brist, Gary A. ; et al.	2003-08-07
Standoff arrangements to control distance and provide electrical function App 20030145460 - Jessep, Rebecca A. ; et al.	2003-08-07
Vented vias for via in pad technology yield improvements Grant 6,580,174 - McCormick , et al. June 17, 2	2003-06-17
Vented Vias For Via In Pad Technology Yield Improvements App 20030064546 - McCormick, Carolyn R. ; et al.	2003-04-03
Coupon registration mechanism and method App 20030056365 - Boggs, David W. ; et al.	2003-03-27

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