Sathe; Ajit V.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sathe; Ajit V..The latest application filed is for "multiple socket concept".

Company Profile

0.10.13

Sathe; Ajit V. - Chandler AZ US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit package having bottom-side stiffener Grant 8,952,511 - Sathe , et al. February 10, 2	2015-02-10
Multiple Socket Concept App 20130005162 - MALLIK; Debendra ; et al.	2013-01-03
Multiple-dice packages using elements between dice to control application of underfill material to reduce void formation Grant 7,589,395 - Sathe , et al. September 15, 2	2009-09-15
Integrated Circuit Package Having Bottom-side Stiffener App 20090152738 - Sathe; Ajit V. ; et al.	2009-06-18
Multiple-dice Packages With Controlled Underfill And Methods Of Manufacture App 20080001310 - Sathe; Ajit V. ; et al.	2008-01-03
Reworkable thermal interface material Grant 7,253,523 - Dani , et al. August 7, 2	2007-08-07
Solderless electronics packaging and methods of manufacture Grant 7,159,313 - Sathe , et al. January 9, 2	2007-01-09
System and method for securing mobile equipment App 20050287986 - Sathe, Ajit V. ; et al.	2005-12-29
Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate Grant 6,903,278 - Sathe June 7, 2	2005-06-07
Solderless electronics packaging and methods of manufacture App 20050091844 - Sathe, Ajit V. ; et al.	2005-05-05
Reworkable thermal interface material App 20050027055 - Dani, Ashay A. ; et al.	2005-02-03
Flexible tape electronics packaging and methods of manufacture App 20050017345 - Sathe, Ajit V.	2005-01-27
Solderless electronics packaging Grant 6,840,777 - Sathe , et al. January 11, 2	2005-01-11
Flexible tape electronics packaging Grant 6,800,947 - Sathe October 5, 2	2004-10-05
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment Grant 6,661,660 - Prasher , et al. December 9, 2	2003-12-09
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment Grant 6,639,799 - Prasher , et al. October 28, 2	2003-10-28
Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate App 20030000736 - Sathe, Ajit V.	2003-01-02
Flexible tape electronics packaging App 20030001287 - Sathe, Ajit V.	2003-01-02
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment App 20020080584 - Prasher, Ravi ; et al.	2002-06-27
Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment App 20020080583 - Prasher, Ravi ; et al.	2002-06-27
Electronic assembly having a heat pipe that conducts heat from a semiconductor die App 20020067598 - Sathe, Ajit V. ; et al.	2002-06-06
Solderless electronics packaging and methods of manufacture App 20020065965 - Sathe, Ajit V. ; et al.	2002-05-30

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.