Sashima; Hiroki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sashima; Hiroki.The latest application filed is for "encapsulating material and loc structure semiconductor device using the same".
- Sashima; Hiroki - Shimodate JP
| Patent | Date |
|---|---|
| Encapsulating material and LOC structure semiconductor device using the same Grant 6,211,277 - Kawata , et al. April 3, 2 | 2001-04-03 |
| Semiconductor sealant of epoxy resin and organic polymer-grafted silicone polymer Grant 5,962,139 - Hagiwara , et al. October 5, 1 | 1999-10-05 |
| Epoxy resin molding for sealing electronic parts containing organic polymer-grafted silicone Grant 5,739,217 - Hagiwara , et al. April 14, 1 | 1998-04-14 |
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