Sasaoka; Kenji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sasaoka; Kenji.The latest application filed is for "component built-in wiring board and manufacturing method of component built-in wiring board".

Company Profile

0.16.11

Sasaoka; Kenji - Tokyo JP
Sasaoka; Kenji - Fuchu JP
Sasaoka; Kenji - Zama JP
Sasaoka; Kenji - Zama-shi JP
Sasaoka; Kenji - Fuchu-shi Tokyo

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Component built-in wiring board and manufacturing method of component built-in wiring board Grant 8,987,901 - Sasaoka March 24, 2	2015-03-24
Wiring board with a built-in component and method for manufacturing the same Grant 8,737,085 - Sasaoka May 27, 2	2014-05-27
Component Built-in Wiring Board And Manufacturing Method Of Component Built-in Wiring Board App 20130082370 - Sasaoka; Kenji	2013-04-04
Component built-in wiring board and manufacturing method of component built-in wiring board Grant 8,350,388 - Sasaoka January 8, 2	2013-01-08
Electronic component built-in wiring board and method for radiating heat generated at the same Grant 8,198,541 - Sasaoka , et al. June 12, 2	2012-06-12
Component Built-in Wiring Board And Manufacturing Method Of Component Built-in Wiring Board App 20100301473 - Sasaoka; Kenji	2010-12-02
Electronic Component Built-in Wiring Board And Method For Radiating Heat Generated At The Same App 20100025082 - Sasaoka; Kenji ; et al.	2010-02-04
Component built-in wiring board and manufacturing method of component built-in wiring board Grant 7,644,497 - Imamura , et al. January 12, 2	2010-01-12
Apparatus for manufacturing a wiring board Grant 7,526,859 - Sasaoka , et al. May 5, 2	2009-05-05
Wiring Board With A Built-in Component And Method For Manufacturing The Same App 20090107715 - Sasaoka; Kenji	2009-04-30
Component built-in wiring board and manufacturing method of component built-in wiring board App 20080163486 - Imamura; Tatsuro ; et al.	2008-07-10
Component built-in wiring board and manufacturing method of component built-in wiring board Grant 7,345,888 - Imamura , et al. March 18, 2	2008-03-18
Component built-in wiring board and manufacturing method of component built-in wiring board App 20070195511 - Imamura; Tatsuro ; et al.	2007-08-23
Wiring board incorporating components and process for producing the same Grant 7,242,591 - Imamura , et al. July 10, 2	2007-07-10
Apparatus for manufacturing a wiring board and method for manufacturin a wiring board App 20070044294 - Sasaoka; Kenji ; et al.	2007-03-01
Method for manufacturing a wiring board Grant 7,134,193 - Sasaoka , et al. November 14, 2	2006-11-14
Wiring board incorporating components and process for producing the same App 20060154496 - Imamura; Tatsuro ; et al.	2006-07-13
Apparatus for manufacturing a wiring board and method for manufacturing a wiring board App 20050115068 - Sasaoka, Kenji ; et al.	2005-06-02
Apparatus for manufacturing a wiring board Grant 6,865,801 - Sasaoka , et al. March 15, 2	2005-03-15
Wiring board, wiring board fabrication method, and semiconductor package Grant 6,353,189 - Shimada , et al. March 5, 2	2002-03-05
Apparatus for manufacturing a wiring board and method for manufacturing a wiring board App 20010039720 - Sasaoka, Kenji ; et al.	2001-11-15
Multilayer wiring board and method for forming the same Grant 6,010,769 - Sasaoka , et al. January 4, 2	2000-01-04
Circuit devices and fabrication Method of the same Grant 5,822,850 - Odaira , et al. October 20, 1	1998-10-20
Circuit devices and fabrication method of the same Grant 5,600,103 - Odaira , et al. February 4, 1	1997-02-04

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