Sasaki; Takatoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sasaki; Takatoshi.The latest application filed is for "inspection device for hydraulic equipment, inspection system for hydraulic equipment, work vehicle, and inspection method for hydraulic equipment".

Company Profile

1.2.18

Sasaki; Takatoshi - Ibaraki JP
SASAKI; Takatoshi - Tokyo JP
SASAKI; Takatoshi - Ibaraki-shi JP
SASAKI; Takatoshi - Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pressure-sensitive adhesive tape for protecting semiconductor Grant 11,254,844 - Sasaki , et al. February 22, 2	2022-02-22
Inspection Device For Hydraulic Equipment, Inspection System For Hydraulic Equipment, Work Vehicle, And Inspection Method For Hydraulic Equipment App 20220050058 - SASAKI; Takatoshi ; et al.	2022-02-17
Pressure-sensitive Adhesive Tape For Protecting Semiconductor App 20200095475 - SASAKI; Takatoshi ; et al.	2020-03-26
Pressure-sensitive Adhesive Sheet For Dicing And Method Of Manufacturing Semiconductor Device Using Pressure-sensitive Adhesive Sheet For Dicing App 20130122688 - Sasaki; Takatoshi ; et al.	2013-05-16
Re-peelable Adhesive Sheet App 20110097576 - HABU; Takashi ; et al.	2011-04-28
Adhesive Sheet For Supporting And Protecting Semiconductor Wafer And Method For Grinding Back Of Semiconductor Wafer App 20110030881 - SASAKI; Takatoshi ; et al.	2011-02-10
Adhesive Sheet For Supporting And Protecting Semiconductor Wafer And Method For Grinding Back Of Semiconductor Wafer App 20110030882 - MIZUNO; Kouji ; et al.	2011-02-10
Surface Protective Sheet App 20110008597 - ASAI; Fumiteru ; et al.	2011-01-13
Method Of Grinding Back Side Of Semiconductor Wafer And Adhesive Sheet For Use In The Method Of Grinding Back Side Of Semiconductor Wafer App 20090314417 - SASAKI; Takatoshi ; et al.	2009-12-24
Adhesive Sheet For Water Jet Laser Dicing App 20090311474 - Takahashi; Tomokazu ; et al.	2009-12-17
Adhesive Sheet For Water Jet Laser Dicing App 20080182095 - Asai; Fumiteru ; et al.	2008-07-31
Removable Pressure-sensitive Adhesive Composition And Pressure-sensitive Adhesive Tape Or Sheet App 20080138618 - Sasaki; Takatoshi ; et al.	2008-06-12
Adhesive Sheet For Water Jet Laser Dicing App 20080108262 - Asai; Fumiteru ; et al.	2008-05-08
Adhesive sheet for laser processing App 20080085397 - Asai; Fumiteru ; et al.	2008-04-10
Adhesive sheet for laser processing App 20080057306 - Sasaki; Takatoshi ; et al.	2008-03-06
Adhesive sheet for water jet laser dicing App 20080057253 - Sasaki; Takatoshi ; et al.	2008-03-06
Adhesive sheet for water jet laser dicing App 20080057270 - Miki; Tsubasa ; et al.	2008-03-06
Hydrophilized porous film and process for producing the same Grant 7,115,680 - Fujioka , et al. October 3, 2	2006-10-03
Hydrophilized porous film and process for producing the same App 20040242752 - Fujioka, Hiroki ; et al.	2004-12-02

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