Sarkhel; Amit K.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sarkhel; Amit K..The latest application filed is for "printed circuit board with mixed metallurgy pads and method of fabrication".

Company Profile

0.9.5

Sarkhel; Amit K. - Endicott NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of fabricating printed circuit board with mixed metallurgy pads Grant 6,931,722 - Arrington , et al. August 23, 2	2005-08-23
Lead-free solder structure and method for high fatigue life Grant 6,784,086 - Ray , et al. August 31, 2	2004-08-31
Method of forming metallic z-interconnects for laminate chip packages and boards Grant 6,634,543 - Curcio , et al. October 21, 2	2003-10-21
Printed circuit board with mixed metallurgy pads and method of fabrication App 20030177635 - Arrington, Edward L. ; et al.	2003-09-25
Method of forming metallic z-interconnects for laminate chip packages and boards App 20030127495 - Curcio, Brian E. ; et al.	2003-07-10
Electronic package interconnect structure comprising lead-free solders Grant 6,581,821 - Sarkhel June 24, 2	2003-06-24
Electronic package interconnect structure comprising lead-free solders App 20020192443 - Sarkhel, Amit K.	2002-12-19
Printed circuit board with mixed metallurgy pads and method of fabrication App 20020157861 - Arrington, Edward L. ; et al.	2002-10-31
Lead-free solder structure and method for high fatigue life App 20020149113 - Ray, Sudipta K. ; et al.	2002-10-17
Electronic package interconnect structure comprising lead-free solders Grant 6,433,425 - Sarkhel August 13, 2	2002-08-13
High density column grid array connections and method thereof Grant 6,429,388 - Interrante , et al. August 6, 2	2002-08-06
Substrate structure for improving attachment reliability of semiconductor chips and modules Grant 6,281,581 - Desai , et al. August 28, 2	2001-08-28
Substrate structure and method for improving attachment reliability of semiconductor chips and modules Grant 6,002,172 - Desai , et al. December 14, 1	1999-12-14
Lead-free, tin-based multi-component solder alloys Grant 5,730,932 - Sarkhel , et al. March 24, 1	1998-03-24

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