Sarkar; Siuli
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sarkar; Siuli.The latest application filed is for "solder paste for module fabrication of solar cells".
Company Profile
17.22.48
- Sarkar; Siuli - Bangalore IN
- SARKAR; Siuli - Waterbury CT
- Sarkar; Siuli - South Plainfield NJ
- SARKAR; Siuli - Karnataka IN
- Sarkar; Siuli - Kaval Byrasandra Bangalore
Patent Activity
| Patent | Date |
|---|---|
| Advanced solder alloys for electronic interconnects Grant 11,411,150 - de Avila Ribas , et al. August 9, 2 | 2022-08-09 |
| Sintering materials and attachment methods using same Grant 11,389,865 - Ghoshal , et al. July 19, 2 | 2022-07-19 |
| Solder Paste For Module Fabrication Of Solar Cells App 20220216357 - PUJARI; Narahari ; et al. | 2022-07-07 |
| Sintering Powder App 20220169905 - Ghosal; Shamik ; et al. | 2022-06-02 |
| Lead-free Solder Compositions App 20220072664 - PANDHER; Ranjit ; et al. | 2022-03-10 |
| Dielectric Ink Composition App 20220064466 - PUJARI; Narahari ; et al. | 2022-03-03 |
| Dielectric ink composition Grant 11,193,031 - Pujari , et al. December 7, 2 | 2021-12-07 |
| Stretchable Interconnects for Flexible Electronic Surfaces App 20210350949 - PUJARI; Narahari ; et al. | 2021-11-11 |
| Sintering paste Grant 11,162,007 - Ghosal , et al. November 2, 2 | 2021-11-02 |
| Stretchable interconnects for flexible electronic surfaces Grant 11,139,089 - Pujari , et al. October 5, 2 | 2021-10-05 |
| Low Temperature Soldering Solutions For Polymer Substrates, Printed Circuit Boards And Other Joining Applications App 20210283727 - RAUT; Rahul ; et al. | 2021-09-16 |
| Lead-free and antimony-free tin solder reliable at high temperatures Grant 11,090,768 - Choudhury , et al. August 17, 2 | 2021-08-17 |
| Low Pressure Sintering Powder App 20210249376 - Ghoshal; Shamik ; et al. | 2021-08-12 |
| Multilayered Metal Nano And Micron Particles App 20210205935 - Ghoshal; Shamik ; et al. | 2021-07-08 |
| Nano Copper Paste And Film For Sintered Die Attach And Similar Applications App 20210162496 - GHOSAL; Shamik ; et al. | 2021-06-03 |
| Low pressure sintering powder Grant 10,998,284 - Ghoshal , et al. May 4, 2 | 2021-05-04 |
| Multilayered metal nano and micron particles Grant 10,894,302 - Ghoshal , et al. January 19, 2 | 2021-01-19 |
| High reliability lead-free solder alloy Grant 10,821,557 - Ribas , et al. November 3, 2 | 2020-11-03 |
| Stretchable Interconnects for Flexible Electronic Surfaces App 20200294686 - PUJARI; Narahari ; et al. | 2020-09-17 |
| Dielectric Ink Composition App 20200190347 - PUJARI; Narahari ; et al. | 2020-06-18 |
| Engineered polymer-based electronic materials Grant 10,682,732 - Venkatagiriyappa , et al. | 2020-06-16 |
| Stretchable interconnects for flexible electronic surfaces Grant 10,672,531 - Pujari , et al. | 2020-06-02 |
| Graphene Enhanced And Engineered Materials For Membrane Touch Switch And Other Flexible Electronic Structures App 20200087528 - CHAKI; Nirmalya Kumar ; et al. | 2020-03-19 |
| High Reliability Lead-Free Solder Alloy App 20190389012 - Ribas; Morgana De Avila ; et al. | 2019-12-26 |
| Metal recovery Grant 10,494,696 - Pujari , et al. De | 2019-12-03 |
| High Impact Solder Toughness Alloy App 20190262951 - Pandher; Ranjit ; et al. | 2019-08-29 |
| High Impact Solder Toughness Alloy App 20190255662 - Pandher; Ranjit ; et al. | 2019-08-22 |
| Sintering Powder App 20190194517 - Ghosal; Shamik ; et al. | 2019-06-27 |
| Low temperature high reliability alloy for solder hierarchy Grant 10,322,471 - Choudhury , et al. | 2019-06-18 |
| Advanced Solder Alloys For Electronic Interconnects App 20190157535 - de Avila Ribas; Morgana ; et al. | 2019-05-23 |
| Engineered Polymer-Based Electronic Materials App 20190143461 - Venkatagiriyappa; Ramakrishna Hosur ; et al. | 2019-05-16 |
| Sintering powder Grant 10,259,980 - Ghosal , et al. | 2019-04-16 |
| Method for manufacturing metal powder Grant 10,130,995 - Chaki , et al. November 20, 2 | 2018-11-20 |
| High Impact Solder Toughness Alloy App 20180290244 - Pandher; Ranjit ; et al. | 2018-10-11 |
| Advanced Solder Alloys For Electronic Interconnects App 20180102464 - de Avila Ribas; Morgana ; et al. | 2018-04-12 |
| Production of Graphene App 20180072573 - Chaki; Nirmalya Kumar ; et al. | 2018-03-15 |
| Engineered Polymer-Based Electronic Materials App 20180056455 - Venkatagiriyappa; Ramakrishna Hosur ; et al. | 2018-03-01 |
| Rosin-free thermosetting flux formulations Grant 9,802,275 - Ribas , et al. October 31, 2 | 2017-10-31 |
| High Impact Solder Toughness Alloy App 20170304955 - Pandher; Ranjit ; et al. | 2017-10-26 |
| Dual-side reinforcement flux for encapsulation Grant 9,786,629 - Venkatagiriyappa , et al. October 10, 2 | 2017-10-10 |
| Flux formulations Grant 9,751,159 - Pujari , et al. September 5, 2 | 2017-09-05 |
| Low Temperature High Reliability Alloy for Solder Hierarchy App 20170197281 - Choudhury; Pritha ; et al. | 2017-07-13 |
| Stretchable Interconnects for Flexible Electronic Surfaces App 20170200527 - PUJARI; Narahari ; et al. | 2017-07-13 |
| Sintering Materials and Attachment Methods Using Same App 20170144221 - GHOSHAL; Shamik ; et al. | 2017-05-25 |
| High Impact Solder Toughness Alloy App 20170136583 - Pandher; Ranjit ; et al. | 2017-05-18 |
| Engineered Residue Solder Paste Technology App 20170135227 - Ramakrishna; Hosur Venkatagiriyappa ; et al. | 2017-05-11 |
| Multilayered Metal Nano and Micron Particles App 20170113306 - Ghoshal; Shamik ; et al. | 2017-04-27 |
| Flux Formulations App 20170106479 - Pujari; Narahari ; et al. | 2017-04-20 |
| Flux formulations Grant 9,566,668 - Pujari , et al. February 14, 2 | 2017-02-14 |
| Method for Manufacturing Metal Powder App 20170028477 - Setna; Rohan P. ; et al. | 2017-02-02 |
| Low Pressure Sintering Powder App 20170033073 - GHOSHAL; Shamik ; et al. | 2017-02-02 |
| Rosin-Free Thermosetting Flux Formulations App 20160318134 - Ribas; Morgana de Avila ; et al. | 2016-11-03 |
| Metal Recovery App 20160304989 - Pujari; Narahari ; et al. | 2016-10-20 |
| High Impact Solder Toughness Alloy App 20160214213 - Pandher; Ranjit ; et al. | 2016-07-28 |
| Dual-side Reinforcement Flux For Encapsulation App 20160163672 - Venkatagiriyappa; Ramakrishna Hosur ; et al. | 2016-06-09 |
| High Impact Solder Toughness Alloy App 20160144462 - Pandher; Ranjit ; et al. | 2016-05-26 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20160023309 - Choudhury; Pritha ; et al. | 2016-01-28 |
| Particles and inks and films using them Grant 9,217,088 - Parashar , et al. December 22, 2 | 2015-12-22 |
| Sintering Powder App 20150353804 - Ghosal; Shamik ; et al. | 2015-12-10 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150266137 - Choudhury; Pritha ; et al. | 2015-09-24 |
| Lead-free And Antimony-free Tin Solder Reliable At High Temperatures App 20150224604 - Choudhury; Pritha ; et al. | 2015-08-13 |
| High Impact Toughness Solder Alloy App 20140219711 - Pandher; Ranjit ; et al. | 2014-08-07 |
| Solder Compositions App 20140199115 - de Avila Ribas; Morgana ; et al. | 2014-07-17 |
| Flux Formulations App 20140060703 - Pujari; Narahari ; et al. | 2014-03-06 |
| Particles And Inks And Films Using Them App 20110318478 - Parashar; Sachin ; et al. | 2011-12-29 |
| Particles and inks and films using them Grant 7,968,008 - Parashar , et al. June 28, 2 | 2011-06-28 |
| Particles And Inks And Films Using Them App 20080032047 - Parashar; Sachin ; et al. | 2008-02-07 |
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