Sarihan; Vijay

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sarihan; Vijay.The latest application filed is for "package with low stress region for an electronic component".

Company Profile

0.12.8

Sarihan; Vijay - Paradise Valley AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package with low stress region for an electronic component Grant 9,818,712 - Holm , et al. November 14, 2	2017-11-14
Solder pad for semiconductor device package Grant 9,548,280 - Sarihan , et al. January 17, 2	2017-01-17
Method for shielding MEMS structures during front side wafer dicing Grant 9,458,012 - Magnus , et al. October 4, 2	2016-10-04
Package With Low Stress Region For An Electronic Component App 20160204089 - HOLM; PAIGE M. ; et al.	2016-07-14
Microelectromechanical systems (MEMS) devices with control circuits and methods of fabrication Grant 9,359,192 - Bowles , et al. June 7, 2	2016-06-07
Solder Pad for Semiconductor Device Package App 20150287685 - Sarihan; Vijay ; et al.	2015-10-08
Method For Shielding Mems Structures During Front Side Wafer Dicing App 20150232332 - Magnus; Alan J. ; et al.	2015-08-20
Package for high power integrated circuits and method for forming Grant 8,148,206 - Sarihan April 3, 2	2012-04-03
Method for forming a packaged semiconductor device having a ground plane Grant 8,080,444 - Sarihan December 20, 2	2011-12-20
Method For Forming A Packaged Semiconductor Device Having A Ground Plane App 20110171782 - Sarihan; Vijay	2011-07-14
Electronic assembly and method for forming the same App 20070200253 - Gogoi; Bishnu P. ; et al.	2007-08-30
Radiation shielded module and method of shielding microelectronic device Grant 7,145,084 - Sarihan , et al. December 5, 2	2006-12-05
Under bump metallurgy structural design for high reliability bumped packages Grant 6,930,032 - Sarihan , et al. August 16, 2	2005-08-16
Semiconductor power device with shear stress compensation Grant 6,888,246 - Mercado , et al. May 3, 2	2005-05-03
Semiconductor power device and method of formation App 20030232493 - Mercado, Lei L. ; et al.	2003-12-18
Under bump metallurgy structural design for high reliability bumped packages App 20030214036 - Sarihan, Vijay ; et al.	2003-11-20
Semiconductor power device and method of formation Grant 6,646,347 - Mercado , et al. November 11, 2	2003-11-11
Semiconductor Power Device And Method Of Formation App 20030102563 - Mercado, Lei L. ; et al.	2003-06-05
Method and apparatus for stress relief in solder bump formation on a semiconductor device Grant 6,077,726 - Mistry , et al. June 20, 2	2000-06-20
Micromachined flow sensor device using a pressure difference and method of manufacturing the same Grant 5,515,735 - Sarihan May 14, 1	1996-05-14

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