Sarangapani; Murali
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sarangapani; Murali.The latest application filed is for "process for electrically connecting contact surfaces of electroniccomponents".
- Sarangapani; Murali - Singapore SG
| Patent | Date |
|---|---|
| Process For Electrically Connecting Contact Surfaces Of Electroniccomponents App 20220037284 - Pun; Yean M. ; et al. | 2022-02-03 |
| Coated wire Grant 11,236,430 - Lim , et al. February 1, 2 | 2022-02-01 |
| Coated Wire App 20210222313 - Lim; Yee Weon ; et al. | 2021-07-22 |
| Coated wire Grant 10,960,498 - Kang , et al. March 30, 2 | 2021-03-30 |
| Coated Wire App 20180345421 - Kang; Il Tae ; et al. | 2018-12-06 |
| Copper Bonding Wire With Angstrom ( ) Thick Surface Oxide Layer App 20170154863 - SARANGAPANI; Murali ; et al. | 2017-06-01 |
| Alloyed 2N copper wires for bonding in microelectronics devices Grant 9,589,694 - Sarangapani , et al. March 7, 2 | 2017-03-07 |
| Copper Bond Wire And Method Of Making The Same App 20160078980 - SARANGAPANI; Murali ; et al. | 2016-03-17 |
| Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics Devices App 20130140068 - SARANGAPANI; Murali ; et al. | 2013-06-06 |
| Alloyed 2N Copper Wires for Bonding in Microelectronics Devices App 20130140084 - SARANGAPANI; Murali ; et al. | 2013-06-06 |
| 3n Copper Wires With Trace Additions For Bonding In Microelectronics Devices App 20130142568 - SARANGAPANI; Murali ; et al. | 2013-06-06 |
| Doped 4n Copper Wires For Bonding In Microelectronics Devices App 20130142567 - SARANGAPANI; Murali ; et al. | 2013-06-06 |
| Mold for encapsulating a semiconductor chip Grant 6,860,731 - Ho , et al. March 1, 2 | 2005-03-01 |
| Mold App 20030006529 - Ho, Shu Chuen ; et al. | 2003-01-09 |
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