loadpatents
name:-0.15862488746643
name:-0.017998933792114
name:-0.00050616264343262
Saran; Mukul Patent Filings

Saran; Mukul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Saran; Mukul.The latest application filed is for "apparatus for improved power distribution in wirebond semiconductor packages".

Company Profile
0.13.11
  • Saran; Mukul - Richardson TX
  • Saran; Mukul - Kanata CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Apparatus for improved power distribution in wirebond semiconductor packages
Grant 7,727,801 - Saran June 1, 2
2010-06-01
Apparatus for Improved Power Distribution in Wirebond Semiconductor Packages
App 20090191664 - Saran; Mukul
2009-07-30
Method of improving power distribution in wirebond semiconductor packages
Grant 7,534,630 - Saran May 19, 2
2009-05-19
Semiconductor packages for enhanced number of terminals, speed and power performance
Grant 7,338,837 - Howard , et al. March 4, 2
2008-03-04
Apparatus for Improved Power Distribution in Wirebond Semiconductor Packages
App 20070087476 - Saran; Mukul
2007-04-19
Reliable integrated circuit and package
App 20060289974 - Saran; Mukul ;   et al.
2006-12-28
Apparatus for improved power distribution in wirebond semiconductor packages
Grant 7,151,309 - Saran December 19, 2
2006-12-19
Apparatus for improved power distribution in wirebond semiconductor packages
App 20060043557 - Saran; Mukul
2006-03-02
Semiconductor packages for enhanced number of terminals, speed and power performance
App 20050127492 - Howard, Gregory E. ;   et al.
2005-06-16
Semiconductor packages for enhanced number of terminals, speed and power performance
Grant 6,873,040 - Howard , et al. March 29, 2
2005-03-29
Semiconductor packages for enhanced number of terminals, speed and power performance
App 20050006739 - Howard, Gregory E. ;   et al.
2005-01-13
Fine pitch system and method for reinforcing bond pads in semiconductor devices
Grant 6,818,540 - Saran , et al. November 16, 2
2004-11-16
Reliable integrated circuit and package
App 20040124546 - Saran, Mukul ;   et al.
2004-07-01
High capacitance damascene capacitors
App 20040009640 - Saran, Mukul
2004-01-15
System and method for reinforcing a bond pad
Grant 6,625,882 - Saran , et al. September 30, 2
2003-09-30
High capacitance damascene capacitors
Grant 6,617,208 - Saran September 9, 2
2003-09-09
Fine pitch system and method for reinforcing bond pads in semiconductor devices
App 20020187634 - Saran, Mukul ;   et al.
2002-12-12
Fine pitch system and method for reinforcing bond pads in semiconductor devices
Grant 6,448,650 - Saran , et al. September 10, 2
2002-09-10
Method for reducing via resistance in small high aspect ratio holes filled using aluminum extrusion
Grant 6,443,743 - Saran September 3, 2
2002-09-03
Fine Pitch System And Method For Reinforcing Bond Pads In Semiconductor Devices
App 20020089062 - SARAN, MUKUL ;   et al.
2002-07-11
High capacitance damascene capacitors
App 20020022331 - Saran, Mukul
2002-02-21
System and method for bonding over active integrated circuits
Grant 6,232,662 - Saran May 15, 2
2001-05-15
System and method for reinforcing a bond pad
Grant 6,143,396 - Saran , et al. November 7, 2
2000-11-07
Capacitor structure for an integrated circuit
Grant 5,583,359 - Ng , et al. December 10, 1
1996-12-10

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