Patent | Date |
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Apparatus for improved power distribution in wirebond semiconductor packages Grant 7,727,801 - Saran June 1, 2 | 2010-06-01 |
Apparatus for Improved Power Distribution in Wirebond Semiconductor Packages App 20090191664 - Saran; Mukul | 2009-07-30 |
Method of improving power distribution in wirebond semiconductor packages Grant 7,534,630 - Saran May 19, 2 | 2009-05-19 |
Semiconductor packages for enhanced number of terminals, speed and power performance Grant 7,338,837 - Howard , et al. March 4, 2 | 2008-03-04 |
Apparatus for Improved Power Distribution in Wirebond Semiconductor Packages App 20070087476 - Saran; Mukul | 2007-04-19 |
Reliable integrated circuit and package App 20060289974 - Saran; Mukul ;   et al. | 2006-12-28 |
Apparatus for improved power distribution in wirebond semiconductor packages Grant 7,151,309 - Saran December 19, 2 | 2006-12-19 |
Apparatus for improved power distribution in wirebond semiconductor packages App 20060043557 - Saran; Mukul | 2006-03-02 |
Semiconductor packages for enhanced number of terminals, speed and power performance App 20050127492 - Howard, Gregory E. ;   et al. | 2005-06-16 |
Semiconductor packages for enhanced number of terminals, speed and power performance Grant 6,873,040 - Howard , et al. March 29, 2 | 2005-03-29 |
Semiconductor packages for enhanced number of terminals, speed and power performance App 20050006739 - Howard, Gregory E. ;   et al. | 2005-01-13 |
Fine pitch system and method for reinforcing bond pads in semiconductor devices Grant 6,818,540 - Saran , et al. November 16, 2 | 2004-11-16 |
Reliable integrated circuit and package App 20040124546 - Saran, Mukul ;   et al. | 2004-07-01 |
High capacitance damascene capacitors App 20040009640 - Saran, Mukul | 2004-01-15 |
System and method for reinforcing a bond pad Grant 6,625,882 - Saran , et al. September 30, 2 | 2003-09-30 |
High capacitance damascene capacitors Grant 6,617,208 - Saran September 9, 2 | 2003-09-09 |
Fine pitch system and method for reinforcing bond pads in semiconductor devices App 20020187634 - Saran, Mukul ;   et al. | 2002-12-12 |
Fine pitch system and method for reinforcing bond pads in semiconductor devices Grant 6,448,650 - Saran , et al. September 10, 2 | 2002-09-10 |
Method for reducing via resistance in small high aspect ratio holes filled using aluminum extrusion Grant 6,443,743 - Saran September 3, 2 | 2002-09-03 |
Fine Pitch System And Method For Reinforcing Bond Pads In Semiconductor Devices App 20020089062 - SARAN, MUKUL ;   et al. | 2002-07-11 |
High capacitance damascene capacitors App 20020022331 - Saran, Mukul | 2002-02-21 |
System and method for bonding over active integrated circuits Grant 6,232,662 - Saran May 15, 2 | 2001-05-15 |
System and method for reinforcing a bond pad Grant 6,143,396 - Saran , et al. November 7, 2 | 2000-11-07 |
Capacitor structure for an integrated circuit Grant 5,583,359 - Ng , et al. December 10, 1 | 1996-12-10 |