Sapozhnikov; Mike

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sapozhnikov; Mike.The latest application filed is for "high speed traceless interconnect".

Company Profile

10.7.10

Sapozhnikov; Mike - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Optimizing design and performance for printed circuit boards Grant 11,425,821 - Koul , et al. August 23, 2	2022-08-23
High Speed Traceless Interconnect App 20220181807 - Visneski; Jason ; et al.	2022-06-09
Fiber Weave Skew Assessment For Printed Circuit Boards App 20220128350 - Koul; Amendra ; et al.	2022-04-28
Fiber Weave Skew Assessment For Printed Circuit Boards App 20220120558 - Koul; Amendra ; et al.	2022-04-21
Fiber weave skew assessment for printed circuit boards Grant 11,293,752 - Koul , et al. April 5, 2	2022-04-05
Fiber weave skew assessment for printed circuit boards Grant 11,287,245 - Koul , et al. March 29, 2	2022-03-29
Optimizing Design And Performance For Printed Circuit Boards App 20210059055 - Koul; Amendra ; et al.	2021-02-25
Fiber Weave Skew Assessment For Printed Circuit Boards App 20200263977 - Koul; Amendra ; et al.	2020-08-20
Fiber Weave Skew Assessment For Printed Circuit Boards App 20200263976 - Koul; Amendra ; et al.	2020-08-20
Removal of channel impairments due to skew and channel asymmetry with a composite filter Grant 10,735,039 - Goergen , et al.	2020-08-04
Fiber weave skew assessment for printed circuit boards Grant 10,684,123 - Koul , et al.	2020-06-16
Measuring effective dielectric constant using via-stub resonance Grant 10,674,598 - Nozadze , et al.	2020-06-02
Network connector assembly Grant 10,431,914 - Curtis , et al. O	2019-10-01
Fiber Weave Skew Assessment For Printed Circuit Boards App 20190219385 - Koul; Amendra ; et al.	2019-07-18
Network Connector Assembly App 20190036252 - Curtis; George Edward ; et al.	2019-01-31
Determining Physical Layer Error Signatures of a Communications Link App 20170132055 - Wu; Hui ; et al.	2017-05-11

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