| Patent | Date |
|---|
Packaged dies with metal outer layers extending from die back sides toward die front sides
Grant 11,437,276 - Molla , et al. September 6, 2 | 2022-09-06 |
Methods Of Fabricating Leadless Power Amplifier Packages Including Topside Terminations
App 20220238450 - Wei; Yun ; et al. | 2022-07-28 |
Circuit Modules With Front-side Interposer Terminals And Through-module Thermal Dissipation Structures
App 20220208646 - Low; Boon Yew ; et al. | 2022-06-30 |
Packaged electronic devices with top terminations
Grant 11,343,919 - Santos , et al. May 24, 2 | 2022-05-24 |
Leadless power amplifier packages including topside terminations and methods for the fabrication thereof
Grant 11,342,275 - Wei , et al. May 24, 2 | 2022-05-24 |
Leadless Power Amplifier Packages Including Topside Terminations And Methods For The Fabrication Thereof
App 20220130768 - Wei; Yun ; et al. | 2022-04-28 |
Packaged Dies With Metal Outer Layers Extending From Die Back Sides Toward Die Front Sides
App 20200335398 - Molla; Jaynal A. ; et al. | 2020-10-22 |
Method of wafer dicing for wafers with backside metallization and packaged dies
Grant 10,741,446 - Molla , et al. A | 2020-08-11 |
Semiconductor package having an isolation wall to reduce electromagnetic coupling
Grant 10,630,243 - Szymanowski , et al. | 2020-04-21 |
Transistor, Packaged Device, And Method Of Fabrication
App 20200098684 - Shilimkar; Vikas ; et al. | 2020-03-26 |
Semiconductor Package Having An Isolation Wall To Reduce Electromagnetic Coupling
App 20200067460 - Szymanowski; Margaret A. ; et al. | 2020-02-27 |
Molded air cavity packages and methods for the production thereof
Grant 10,529,638 - Sanchez , et al. J | 2020-01-07 |
Semiconductor package having an isolation wall to reduce electromagnetic coupling
Grant 10,476,442 - Szymanowski , et al. Nov | 2019-11-12 |
Methods Of Manufacturing Packaged Electronic Devices With Top Terminations
App 20190343005 - Santos; Fernando A. ; et al. | 2019-11-07 |
Molded air cavity packages and methods for the production thereof
Grant 10,396,006 - Sanchez , et al. A | 2019-08-27 |
Methods of manufacturing packaged electronic devices with top terminations
Grant 10,375,833 - Viswanathan , et al. | 2019-08-06 |
Molded Air Cavity Packages And Methods For The Production Thereof
App 20190109060 - SANCHEZ; AUDEL ; et al. | 2019-04-11 |
Molded Air Cavity Packages And Methods For The Production Thereof
App 20190051571 - SANCHEZ; AUDEL ; et al. | 2019-02-14 |
Molded Air Cavity Packages And Methods For The Production Thereof
App 20190043775 - SANCHEZ; AUDEL ; et al. | 2019-02-07 |
Molded Air Cavity Packages And Methods For The Production Thereof
App 20190043774 - SANCHEZ; AUDEL ; et al. | 2019-02-07 |
Molded air cavity packages and methods for the production thereof
Grant 10,199,303 - Sanchez , et al. Fe | 2019-02-05 |
Molded air cavity packages and methods for the production thereof
Grant 10,199,302 - Sanchez , et al. Fe | 2019-02-05 |
Semiconductor Package Having An Isolation Wall To Reduce Electromagnetic Coupling
App 20190028063 - Szymanowski; Margaret A. ; et al. | 2019-01-24 |
Method Of Wafer Dicing For Wafers With Backside Metallization And Packaged Dies
App 20190013242 - Molla; Jaynal A. ; et al. | 2019-01-10 |
Semiconductor package having an isolation wall to reduce electromagnetic coupling
Grant 10,110,170 - Szymanowski , et al. October 23, 2 | 2018-10-23 |
Packaged Electronic Devices With Top Terminations, And Methods Of Manufacture Thereof
App 20180270960 - VISWANATHAN; Lakshminarayan ; et al. | 2018-09-20 |
Packaged electronic devices with top terminations, and methods of manufacture thereof
Grant 9,986,646 - Viswanathan , et al. May 29, 2 | 2018-05-29 |
Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof
Grant 9,800,208 - Shah , et al. October 24, 2 | 2017-10-24 |
Semiconductor Package Having An Isolation Wall To Reduce Electromagnetic Coupling
App 20170005621 - Szymanowski; Margaret A. ; et al. | 2017-01-05 |
Semiconductor package having an isolation wall to reduce electromagnetic coupling
Grant 9,450,547 - Szymanowski , et al. September 20, 2 | 2016-09-20 |
Radio Frequency Devices With Surface-mountable Capacitors For Decoupling And Methods Thereof
App 20160164471 - SHAH; Mahesh K. ; et al. | 2016-06-09 |
System, Method And Apparatus For Leadless Surface Mounted Semiconductor Package
App 20160163623 - Viswanathan; Lakshminarayan ; et al. | 2016-06-09 |
Packaged Electronic Devices With Top Terminations, And Methods Of Manufacture Thereof
App 20160150632 - VISWANATHAN; LAKSHMINARAYAN ; et al. | 2016-05-26 |
Packaged RF amplifier devices and methods of manufacture thereof
Grant 9,337,774 - Szymanowski , et al. May 10, 2 | 2016-05-10 |
Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof
Grant 9,300,254 - Shah , et al. March 29, 2 | 2016-03-29 |
Packaged Rf Amplifier Devices And Methods Of Manufacture Thereof
App 20160087586 - SZYMANOWSKI; MARGARET A. ; et al. | 2016-03-24 |
System, method and apparatus for leadless surface mounted semiconductor package
Grant 9,263,375 - Viswanathan , et al. February 16, 2 | 2016-02-16 |
Wedge bond foot jumper connections
Grant 9,236,363 - Jones , et al. January 12, 2 | 2016-01-12 |
Radio Frequency Devices With Surface-mountable Capacitors For Decoupling And Methods Thereof
App 20150381117 - SHAH; Mahesh K. ; et al. | 2015-12-31 |
Packaged leadless semiconductor device
Grant 9,159,588 - Sanchez , et al. October 13, 2 | 2015-10-13 |
Wedge Bond Foot Jumper Connections
App 20150262961 - Jones; Jeffrey K. ; et al. | 2015-09-17 |
Packaged Leadless Semiconductor Device
App 20150249021 - Sanchez; Audel A. ; et al. | 2015-09-03 |
Method And Apparatus For Multi-chip Structure Semiconductor Package
App 20150171057 - SANTOS; FERNANDO A. ; et al. | 2015-06-18 |
Semiconductor Package Having An Isolation Wall To Reduce Electromagnetic Coupling
App 20150170986 - Szymanowski; Margaret A. ; et al. | 2015-06-18 |
Method and apparatus for multi-chip structure semiconductor package
Grant 8,963,305 - Santos , et al. February 24, 2 | 2015-02-24 |
Self-defining, low capacitance wire bond pad
Grant 8,890,339 - Santos , et al. November 18, 2 | 2014-11-18 |
System, Method And Apparatus For Leadless Surface Mounted Semiconductor Package
App 20140332941 - Viswanathan; Lakshminarayan ; et al. | 2014-11-13 |
Self-defining, Low Capacitance Wire Bond Pad
App 20140319703 - Santos; Fernando A. ; et al. | 2014-10-30 |
System, method and apparatus for leadless surface mounted semiconductor package
Grant 8,803,302 - Viswanathan , et al. August 12, 2 | 2014-08-12 |
Packaged leadless semiconductor device
Grant 8,698,291 - Sanchez , et al. April 15, 2 | 2014-04-15 |
Method And Apparatus For Multi-chip Structure Semiconductor Package
App 20140084432 - Santos; Fernando A. ; et al. | 2014-03-27 |
System, Method And Apparatus For Leadless Surface Mounted Semiconductor Package
App 20130320515 - Viswanathan; Lakshminarayan ; et al. | 2013-12-05 |
Packaged Leadless Semiconductor Device
App 20130154068 - Sanchez; Audel A. ; et al. | 2013-06-20 |
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