Sankarapillai; Chirayarikathuveedu Premachandran
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sankarapillai; Chirayarikathuveedu Premachandran.The latest application filed is for "method of forming through-wafer interconnects for vertical wafer level packaging".
- Sankarapillai; Chirayarikathuveedu Premachandran - Singapore SG
| Patent | Date |
|---|---|
| Method of forming through-wafer interconnects for vertical wafer level packaging Grant 7,381,629 - Sankarapillai , et al. June 3, 2 | 2008-06-03 |
| Method of stacking thin substrates by transfer bonding Grant 7,326,629 - Nagarajan , et al. February 5, 2 | 2008-02-05 |
| Method of forming through-wafer interconnects for vertical wafer level packaging App 20070141804 - Sankarapillai; Chirayarikathuveedu Premachandran ; et al. | 2007-06-21 |
| Method of forming through-wafer interconnects for vertical wafer level packaging Grant 7,183,176 - Sankarapillai , et al. February 27, 2 | 2007-02-27 |
| Method of stacking thin substrates by transfer bonding App 20060057836 - Nagarajan; Ranganathan ; et al. | 2006-03-16 |
| Method of forming through-wafer interconnects for vertical wafer level packaging App 20060046432 - Sankarapillai; Chirayarikathuveedu Premachandran ; et al. | 2006-03-02 |
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