Patent | Date |
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Device and methodology for reducing effective dielectric constant in semiconductor devices Grant 8,343,868 - Edelstein , et al. January 1, 2 | 2013-01-01 |
Capping of copper interconnect lines in integrated circuit devices Grant 8,298,948 - Bonilla , et al. October 30, 2 | 2012-10-30 |
Reducing effective dielectric constant in semiconductor devices Grant 8,129,286 - Edelstein , et al. March 6, 2 | 2012-03-06 |
Interconnect structure for integrated circuits having improved electromigration characteristics Grant 8,056,039 - Chanda , et al. November 8, 2 | 2011-11-08 |
Method of forming an embedded barrier layer for protection from chemical mechanical polishing process Grant 7,968,456 - McLaughlin , et al. June 28, 2 | 2011-06-28 |
Electronics structures using a sacrificial multi-layer hardmask scheme Grant 7,947,907 - Colburn , et al. May 24, 2 | 2011-05-24 |
Capping of Copper Interconnect Lines in Integrated Circuit Devices App 20110108990 - Bonilla; Griselda ;   et al. | 2011-05-12 |
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20110111590 - Edelstein; Daniel C. ;   et al. | 2011-05-12 |
Device and methodology for reducing effective dielectric constant in semiconductor devices Grant 7,892,940 - Edelstein , et al. February 22, 2 | 2011-02-22 |
Reliability of wide interconnects Grant 7,776,737 - Bonilla , et al. August 17, 2 | 2010-08-17 |
Structure and method of forming electrically blown metal fuses for integrated circuits Grant 7,737,528 - Bonilla , et al. June 15, 2 | 2010-06-15 |
Test structure for determining optimal seed and liner layer thicknesses for dual damascene processing Grant 7,671,362 - Bolom , et al. March 2, 2 | 2010-03-02 |
Reliability Of Wide Interconnects App 20100038790 - Bonilla; Griselda ;   et al. | 2010-02-18 |
Dry etchback of interconnect contacts Grant 7,645,700 - Standaert , et al. January 12, 2 | 2010-01-12 |
Interconnect Structure For Integrated Circuits Having Improved Electromigration Characteristics App 20090294973 - Chanda; Kaushik ;   et al. | 2009-12-03 |
Structure And Method Of Forming Electrically Blown Metal Fuses For Integrated Circuits App 20090294901 - Bonilla; Griselda ;   et al. | 2009-12-03 |
Device and methodology for reducing effective dielectric constant in semiconductor devices Grant 7,592,685 - Edelstein , et al. September 22, 2 | 2009-09-22 |
Test Structure For Determining Optimal Seed And Liner Layer Thicknesses For Dual Damascene Processing App 20090146143 - Bolom; Tibor ;   et al. | 2009-06-11 |
Interconnect structure and process of making the same Grant 7,488,679 - Standaert , et al. February 10, 2 | 2009-02-10 |
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20080254630 - EDELSTEIN; Daniel C. ;   et al. | 2008-10-16 |
Electronics Structures Using a Sacrificial Multi-Layer Hardmask Scheme App 20080251284 - Colburn; Matthew Earl ;   et al. | 2008-10-16 |
Embedded Barrier For Dielectric Encapsulation App 20080217777 - McLaughlin; Paul S. ;   et al. | 2008-09-11 |
Device and methodology for reducing effective dielectric constant in semiconductor devices Grant 7,405,147 - Edelstein , et al. July 29, 2 | 2008-07-29 |
Embedded barrier for dielectric encapsulation Grant 7,394,154 - McLaughlin , et al. July 1, 2 | 2008-07-01 |
Process for preparing electronics structures using a sacrificial multilayer hardmask scheme Grant 7,371,684 - Colburn , et al. May 13, 2 | 2008-05-13 |
Dry Etchback Of Interconnect Contacts App 20080088027 - STANDAERT; THEODORUSE ;   et al. | 2008-04-17 |
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20080038923 - EDELSTEIN; Daniel C. ;   et al. | 2008-02-14 |
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20080038915 - EDELSTEIN; Daniel C. ;   et al. | 2008-02-14 |
Interconnect Structure And Process Of Making The Same App 20080026568 - Standaert; Theodorus Eduardus ;   et al. | 2008-01-31 |
Dry etchback of interconnect contacts Grant 7,323,410 - Standaert , et al. January 29, 2 | 2008-01-29 |
Damascene interconnection having a SiCOH low k layer App 20070232048 - Miyata; Koji ;   et al. | 2007-10-04 |
Embedded barrier for dielectric encapsulation App 20070057374 - McLaughlin; Paul S. ;   et al. | 2007-03-15 |
Dry Etchback Of Interconnect Contacts App 20070032055 - Standaert; Theodorus E. ;   et al. | 2007-02-08 |
Process for preparing electronics structures using a sacrificial multilayer hardmask scheme App 20060258159 - Colburn; Matthew Earl ;   et al. | 2006-11-16 |
Device And Methodology For Reducing Effective Dielectric Constant In Semiconductor Devices App 20050167838 - Edelstein, Daniel C. ;   et al. | 2005-08-04 |