Sanftleben; Henry Morris
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sanftleben; Henry Morris.The latest application filed is for "solder joint encapsulation material".
- Sanftleben; Henry Morris - Carmel IN
| Patent | Date |
|---|---|
| Solder joint encapsulation material Grant 5,759,730 - Hermansen , et al. June 2, 1 | 1998-06-02 |
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