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Methods of utilizing low temperature solder assisted mounting techniques for package structures
Grant 11,417,592 - Karhade , et al. August 16, 2 | 2022-08-16 |
Electrical And Optical Interfaces At Different Heights Along An Edge Of A Package To Increase Bandwidth Along The Edge
App 20220100692 - SUBBAREDDY; Dheeraj ; et al. | 2022-03-31 |
Methods of forming flexure based cooling solutions for package structures
Grant 11,276,625 - Kumar , et al. March 15, 2 | 2022-03-15 |
Methods Of Utilizing Low Temperature Solder Assisted Mounting Techniques For Package Structures
App 20210287974 - Karhade; Omkar G. ; et al. | 2021-09-16 |
Methods Of Forming Flexure Based Cooling Solutions For Package Structures
App 20210280495 - Kumar; Siddarth ; et al. | 2021-09-09 |
Package Substrate With Reduced Interconnect Stress
App 20210050306 - Link; Lauren A. ; et al. | 2021-02-18 |
Microelectronic bond pads having integrated spring structures
Grant 10,811,366 - Eid , et al. October 20, 2 | 2020-10-20 |
Interconnect Architecture With Silicon Interposer And Emib
App 20200211969 - HOSSAIN; MD Altaf ; et al. | 2020-07-02 |
Integrated Circuit Packages With Plates
App 20190279960 - Karhade; Omkar G. ; et al. | 2019-09-12 |
Microelectronic bond pads having integrated spring structures
Grant 10,325,860 - Eid , et al. | 2019-06-18 |
Microelectronic Bond Pads Having Integrated Spring Structures
App 20190148311 - Eid; Feras ; et al. | 2019-05-16 |
Warpage controlled package and method for same
Grant 9,953,934 - Kumar , et al. April 24, 2 | 2018-04-24 |
Microelectronic Bond Pads Having Integrated Spring Structures
App 20170309578 - Eid; Feras ; et al. | 2017-10-26 |
Warpage Controlled Package And Method For Same
App 20170178987 - Kumar; Siddarth ; et al. | 2017-06-22 |
Systems and methods for package on package through mold interconnects
Grant 9,659,908 - Sahasrabudhe , et al. May 23, 2 | 2017-05-23 |
Die warpage control for thin die assembly
Grant 9,659,899 - Sane , et al. May 23, 2 | 2017-05-23 |
Systems And Methods For Package On Package Through Mold Interconnects
App 20170133350 - Sahasrabudhe; Shubhada H. ; et al. | 2017-05-11 |
Methods And Devices For Securing And Transporting Singulated Die In High Volume Manufacturing
App 20170032991 - JOHNSON; John C. ; et al. | 2017-02-02 |
Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby
Grant 9,394,619 - Sidhu , et al. July 19, 2 | 2016-07-19 |
Methods And Devices For Securing And Transporting Singulated Die In High Volume Manufacturing
App 20160172222 - JOHNSON; John C. ; et al. | 2016-06-16 |
Contact pads for integrated circuit packages
Grant 9,368,461 - Albers , et al. June 14, 2 | 2016-06-14 |
Contact Pads For Integrated Circuit Packages
App 20150333022 - Albers; Sven ; et al. | 2015-11-19 |
Die Warpage Control For Thin Die Assembly
App 20150318258 - SANE; SANDEEP B. ; et al. | 2015-11-05 |
Die warpage control for thin die assembly
Grant 9,123,732 - Sane , et al. September 1, 2 | 2015-09-01 |
Methods And Devices For Securing And Transporting Singulated Die In High Volume Manufacturing
App 20150187622 - JOHNSON; John C. ; et al. | 2015-07-02 |
Using collapse limiter structures between elements to reduce solder bump bridging
Grant 8,941,236 - Limaye , et al. January 27, 2 | 2015-01-27 |
Methods Of Adding Dopants To Conductive Interconnect Structures In Substrate Technologies And Structures Formed Thereby
App 20140268534 - Sidhu; Rajen S. ; et al. | 2014-09-18 |
Die Warpage Control For Thin Die Assembly
App 20140091470 - Sane; Sandeep B. ; et al. | 2014-04-03 |
Using Collapse Limiter Structures Between Elements To Reduce Solder Bump Bridging
App 20140091456 - LIMAYE; Ameya ; et al. | 2014-04-03 |
Modified chip attach process
Grant 8,324,737 - Chandran , et al. December 4, 2 | 2012-12-04 |
Modified Chip Attach Process
App 20110156254 - Sane; Sandeep B. ; et al. | 2011-06-30 |
Modified chip attach process
Grant 7,901,982 - Sane , et al. March 8, 2 | 2011-03-08 |
Modified Chip Attach Process
App 20090275175 - Sane; Sandeep B. ; et al. | 2009-11-05 |
Modified chip attach process
Grant 7,579,213 - Sane , et al. August 25, 2 | 2009-08-25 |
Modified Chip Attach Process
App 20080057628 - Sane; Sandeep B. ; et al. | 2008-03-06 |
Low temperature phase change thermal interface material dam
Grant 7,312,527 - Sane , et al. December 25, 2 | 2007-12-25 |
Modified chip attach process and apparatus
Grant 7,304,391 - Sane , et al. December 4, 2 | 2007-12-04 |
Low temperature phase change thermal interface material dam
App 20070138621 - Sane; Sandeep B. ; et al. | 2007-06-21 |
Method for reducing assembly-induced stress in a semiconductor die
Grant 7,166,540 - Deshpande , et al. January 23, 2 | 2007-01-23 |
Structure and method to control underfill
App 20060220195 - Sane; Sandeep B. | 2006-10-05 |
Die attach methods and apparatus
App 20060214313 - Pieda; Ruel B. ; et al. | 2006-09-28 |
Method for reducing assembly-induced stress in a semiconductor die
App 20060199299 - Deshpande; Nitin A. ; et al. | 2006-09-07 |
Modified chip attach process and apparatus
App 20060003496 - Sane; Sandeep B. ; et al. | 2006-01-05 |
Modified chip attach process and apparatus
Grant 6,919,224 - Sane , et al. July 19, 2 | 2005-07-19 |
Modified chip attach process and apparatus
App 20050070044 - Sane, Sandeep B. ; et al. | 2005-03-31 |
Laminate substrate containing fiber optic cables
Grant 6,788,859 - Markovich , et al. September 7, 2 | 2004-09-07 |
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