SANE; Sandeep

Patent Applications and Registrations

Patent applications and USPTO patent grants for SANE; Sandeep.The latest application filed is for "processor package with universal optical input/output".

Company Profile

3.5.7

SANE; Sandeep - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Processor Package With Universal Optical Input/output App 20220114121 - THAKUR; Anshuman ; et al.	2022-04-14
Off-package High Density, High Bandwidth Memory Access Using Optical Links App 20220092016 - KUMASHIKAR; Mahesh K. ; et al.	2022-03-24
Systems and methods for replaceable bail grid array (BGA) packages on board substrates Grant 10,531,575 - Sane , et al. J	2020-01-07
Systems And Methods For Replaceable Bail Grid Array (bga) Packages On Board Substrates App 20190037708 - SANE; Sandeep ; et al.	2019-01-31
Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same Grant 8,441,809 - Mahajan , et al. May 14, 2	2013-05-14
Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same Grant 8,064,224 - Mahajan , et al. November 22, 2	2011-11-22
Microelectronic Package Containing Silicon Connecting Region For High Density Interconnects, And Method Of Manufacturing Same App 20110241208 - Mahajan; Ravi ; et al.	2011-10-06
Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby Grant 7,781,260 - Sane , et al. August 24, 2	2010-08-24
Microelectronic Package Containing Silicon Patches For High Density Interconnects, And Method Of Manufacturing Same App 20090244874 - Mahajan; Ravi ; et al.	2009-10-01
Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby App 20090065932 - Sane; Sandeep ; et al.	2009-03-12
Shape memory based mechanical enabling mechanism App 20080079129 - Ganapathysubramanian; Shankar ; et al.	2008-04-03

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