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Kinetically Limited Nano-scale Diffusion Bond Structures And Methods
App 20210197521 - Sandlin; Michael S. ; et al. | 2021-07-01 |
Kinetically limited nano-scale diffusion bond structures and methods
Grant 10,981,355 - Sandlin , et al. April 20, 2 | 2021-04-20 |
Hermetic Conductive Feedthroughs For A Semiconductor Wafer
App 20200062633 - RUBEN; David A. ; et al. | 2020-02-27 |
Feedthrough assemblies and methods of forming same
Grant 10,535,596 - Ruben , et al. Ja | 2020-01-14 |
Hermetic conductive feedthroughs for a semiconductor wafer
Grant 10,464,836 - Ruben , et al. No | 2019-11-05 |
Kinetically Limited Nano-scale Diffusion Bond Structures And Methods
App 20190039347 - Sandlin; Michael S. ; et al. | 2019-02-07 |
Feedthrough Assemblies And Methods Of Forming Same
App 20180374786 - RUBEN; David A. ; et al. | 2018-12-27 |
Kinetically limited nano-scale diffusion bond structures and methods
Grant 10,124,559 - Sandlin , et al. November 13, 2 | 2018-11-13 |
Implantable Medical Devices And Methods Of Forming Same
App 20180263132 - RUBEN; David A. ; et al. | 2018-09-13 |
Implantable medical device system including feedthrough assembly and method of forming same
Grant 9,968,794 - Ruben , et al. May 15, 2 | 2018-05-15 |
Feedthrough assemblies
Grant 9,865,533 - Ruben , et al. January 9, 2 | 2018-01-09 |
Embedded metallic structures in glass
Grant 9,832,867 - Day , et al. November 28, 2 | 2017-11-28 |
Devices formed with techniques for bonding substrates using an intermediate layer
Grant 9,688,053 - Ruben , et al. June 27, 2 | 2017-06-27 |
Embedded Metallic Structures In Glass
App 20170150600 - Day; John K. ; et al. | 2017-05-25 |
Feedthrough Assemblies And Methods Of Forming Same
App 20160190052 - Ruben; David A. ; et al. | 2016-06-30 |
Kinetically Limited Nano-scale Diffusion Bond Structures And Methods
App 20160185081 - Sandlin; Michael S. ; et al. | 2016-06-30 |
Implantable Medical Devices And Methods Of Forming Same
App 20160184593 - Ruben; David A. ; et al. | 2016-06-30 |
Devices Formed With Techniques For Bonding Substrates Using An Intermediate Layer
App 20150367598 - Ruben; David A. ; et al. | 2015-12-24 |
Laser assisted direct bonding
Grant 9,171,721 - Danzl , et al. October 27, 2 | 2015-10-27 |
Techniques for bonding substrates using an intermediate layer
Grant 9,120,287 - Ruben , et al. September 1, 2 | 2015-09-01 |
Hermetic Conductive Feedthroughs For A Semiconductor Wafer
App 20150101841 - Ruben; David A. ; et al. | 2015-04-16 |
Techniques For Bonding Substrates Using An Intermediate Layer
App 20150022983 - Ruben; David A. ; et al. | 2015-01-22 |
Techniques for bonding substrates using an intermediate layer
Grant 8,796,109 - Ruben , et al. August 5, 2 | 2014-08-05 |
Techniques For Bonding Substrates Using An Intermediate Layer
App 20120161305 - Ruben; David A. ; et al. | 2012-06-28 |
Laser Assisted Direct Bonding
App 20120100318 - Danzl; Ralph B. ; et al. | 2012-04-26 |
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