SanDisk Semiconductor (Shanghai) Co. Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for SanDisk Semiconductor (Shanghai) Co. Ltd..The latest application filed is for "heterogeneous fan-out structures for memory devices".

Company Profile

7.21.24

SanDisk Semiconductor (Shanghai) Co. Ltd. - Shanghai N/A CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heterogeneous fan-out structures for memory devices Grant 10,607,955 - Chiu , et al.	2020-03-31
Semiconductor device including dual pad wire bond interconnection Grant 10,483,239 - Yan , et al. Nov	2019-11-19
Semiconductor device including corner recess Grant 10,418,334 - Zhang , et al. Sept	2019-09-17
Semiconductor device including conductive bump interconnections Grant 10,283,485 - Yan , et al.	2019-05-07
Semiconductor device with die tilt control Grant 10,276,546 - Wu , et al.	2019-04-30
Discrete component backward traceability and semiconductor device forward traceability Grant 10,229,886 - Yu , et al.	2019-03-12
Heterogeneous Fan-out Structures For Memory Devices App 20180366429 - Chiu; Chin-Tien ; et al.	2018-12-20
Semiconductor Device Including Conductive Bump Interconnections App 20180337161 - Yan; Junrong ; et al.	2018-11-22
Semiconductor device including die bond pads at a die edge Grant 10,128,218 - Yan , et al. November 13, 2	2018-11-13
Semiconductor Device Including Dual Pad Wire Bond Interconnection App 20180190621 - Yan; Junrong ; et al.	2018-07-05
Semiconductor Device Including Die Bond Pads At A Die Edge App 20180175006 - Yan; Junrong ; et al.	2018-06-21
Semiconductor Device Including Corner Recess App 20180174983 - Zhang; Hang ; et al.	2018-06-21
Semiconductor Device And Method Of Fabricating Semiconductor Device App 20170309608 - Kumar; Shiv ; et al.	2017-10-26
Semiconductor device including independent film layer for embedding and/or spacing semiconductor die Grant 9,773,766 - Ye , et al. September 26, 2	2017-09-26
Bridge Structure For Embedding Semiconductor Die App 20170179101 - Yan; Junrong ; et al.	2017-06-22
Spacer layer for embedding semiconductor die Grant 9,462,694 - Yan , et al. October 4, 2	2016-10-04
Discrete Component Backward Traceability And Semiconductor Device Forward Traceability App 20160181205 - Yu; Cheeman ; et al.	2016-06-23
Semiconductor die laminating device with independent drives Grant 9,331,045 - Gu , et al. May 3, 2	2016-05-03
Semiconductor Device Including Independent Film Layer For Embedding And/or Spacing Semiconductor Die App 20150221624 - Ye; Ning ; et al.	2015-08-06
Epoxy Coating On Substrate For Die Attach App 20150214184 - Gu; Wei ; et al.	2015-07-30
Solder Pillars For Embedding Semiconductor Die App 20150187745 - Chiu; Chin-Tien ; et al.	2015-07-02
Spacer Layer For Embedding Semiconductor Die App 20150187421 - Yan; Junrong ; et al.	2015-07-02
Extrinsic gettering on semiconductor devices Grant 9,064,836 - Chiu , et al. June 23, 2	2015-06-23
Bridge Structure For Embedding Semiconductor Die App 20150155247 - Yan; Junrong ; et al.	2015-06-04
Non-uniform vacuum profile die attach tip Grant 9,038,264 - Rai , et al. May 26, 2	2015-05-26
Semiconductor Die Laminating Device With Independent Drives App 20150115479 - Gu; Wei ; et al.	2015-04-30

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