Sanda; Yasuyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sanda; Yasuyuki.The latest application filed is for "semiconductor device and semiconductor module".

Company Profile

4.7.6

Sanda; Yasuyuki - Tokyo JP
Sanda; Yasuyuki - Chiyoda-ku Tokyo

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and semiconductor module with a highest portion of a terminal lower than a highest portion of the mold sealing resin Grant 11,322,430 - Rokubuichi , et al. May 3, 2	2022-05-03
Semiconductor device and method for manufacturing the same Grant 11,152,280 - Sanda , et al. October 19, 2	2021-10-19
Semiconductor device and method for manufacturing the same Grant 11,107,745 - Sanda , et al. August 31, 2	2021-08-31
Semiconductor device and method of manufacturing the same Grant 11,049,787 - Tada , et al. June 29, 2	2021-06-29
Thermal conductivity measurement device and thermal conductivity measurement method Grant 10,775,329 - Tada , et al. Sept	2020-09-15
Thermal conductivity measurement apparatus and thermal conductivity measurement method Grant 10,768,127 - Sanda , et al. Sep	2020-09-08
Semiconductor Device And Semiconductor Module App 20200176361 - ROKUBUICHI; Hodaka ; et al.	2020-06-04
Semiconductor Device and Method of Manufacturing the Same App 20200043824 - TADA; Haruna ; et al.	2020-02-06
Thermal Conductivity Measurement Device And Thermal Conductivity Measurement Method App 20190369038 - Tada; Haruna ; et al.	2019-12-05
Semiconductor Device and Method for Manufacturing the Same App 20190295919 - Sanda; Yasuyuki ; et al.	2019-09-26
Thermal Conductivity Measurement Apparatus And Thermal Conductivity Measurement Method App 20180299391 - SANDA; Yasuyuki ; et al.	2018-10-18
Swaged heat sink and heat sink integrated power module Grant 9,892,992 - Sanda , et al. February 13, 2	2018-02-13
Swaged Heat Sink And Heat Sink Integrated Power Module App 20160225691 - SANDA; Yasuyuki ; et al.	2016-08-04

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