Sanda; Fumio
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sanda; Fumio.The latest application filed is for "one-pack moisture-curable epoxy resin composition".
- Sanda; Fumio - Kyoto JP
- Sanda; Fumio - Okayama JP
- Sanda; Fumio - Yamato JP
| Patent | Date |
|---|---|
| One-pack moisture-curing epoxy resin composition Grant 7,022,779 - Endo , et al. April 4, 2 | 2006-04-04 |
| One-pack moisture-curing epoxy resin composition App 20040019161 - Endo, Takeshi ; et al. | 2004-01-29 |
| One-pack moisture-curable epoxy resin composition App 20040019140 - Endo, Takeshi ; et al. | 2004-01-29 |
| Spiroorthocarbonate compound and copolymers obtained therefrom Grant 5,298,631 - Sanda , et al. March 29, 1 | 1994-03-29 |
| Disposable moldings and polymer compositions for their production Grant 5,122,561 - Matsumoto , et al. June 16, 1 | 1992-06-16 |
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