Sanchez; Audel A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sanchez; Audel A..The latest application filed is for "packaged electronic devices with top terminations, and methods of manufacture thereof".

Company Profile

1.21.23

Sanchez; Audel A. - Tempe AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of manufacturing packaged electronic devices with top terminations Grant 10,375,833 - Viswanathan , et al.	2019-08-06
Packaged Electronic Devices With Top Terminations, And Methods Of Manufacture Thereof App 20180270960 - VISWANATHAN; Lakshminarayan ; et al.	2018-09-20
Packaged electronic devices with top terminations, and methods of manufacture thereof Grant 9,986,646 - Viswanathan , et al. May 29, 2	2018-05-29
Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof Grant 9,800,208 - Shah , et al. October 24, 2	2017-10-24
Die crack detector with integrated one-time programmable element Grant 9,646,897 - Sanchez , et al. May 9, 2	2017-05-09
System, Method And Apparatus For Leadless Surface Mounted Semiconductor Package App 20160163623 - Viswanathan; Lakshminarayan ; et al.	2016-06-09
Radio Frequency Devices With Surface-mountable Capacitors For Decoupling And Methods Thereof App 20160164471 - SHAH; Mahesh K. ; et al.	2016-06-09
Packaged Electronic Devices With Top Terminations, And Methods Of Manufacture Thereof App 20160150632 - VISWANATHAN; LAKSHMINARAYAN ; et al.	2016-05-26
Radio frequency devices with surface-mountable capacitors for decoupling and methods thereof Grant 9,300,254 - Shah , et al. March 29, 2	2016-03-29
System, method and apparatus for leadless surface mounted semiconductor package Grant 9,263,375 - Viswanathan , et al. February 16, 2	2016-02-16
Radio Frequency Devices With Surface-mountable Capacitors For Decoupling And Methods Thereof App 20150381117 - SHAH; Mahesh K. ; et al.	2015-12-31
Tape release systems and methods for semiconductor dies Grant 9,196,520 - Sanchez , et al. November 24, 2	2015-11-24
Packaged leadless semiconductor device Grant 9,159,588 - Sanchez , et al. October 13, 2	2015-10-13
Packaged Leadless Semiconductor Device App 20150249021 - Sanchez; Audel A. ; et al.	2015-09-03
Devices and methods of operation for separating semiconductor die from adhesive tape Grant 9,111,984 - Sanchez , et al. August 18, 2	2015-08-18
Methods for bonding a die and a substrate Grant 9,111,901 - Jang , et al. August 18, 2	2015-08-18
Semiconductor devices that include a die bonded to a substrate with a gold interface layer Grant 9,105,599 - Jang , et al. August 11, 2	2015-08-11
Method And Apparatus For Multi-chip Structure Semiconductor Package App 20150171057 - SANTOS; FERNANDO A. ; et al.	2015-06-18
Devices And Methods Of Operation For Separating Semiconductor Die From Adhesive Tape App 20150114572 - SANCHEZ; Audel A. ; et al.	2015-04-30
Die Crack Detector With Integrated One-time Programmable Element App 20150115266 - SANCHEZ; Audel A. ; et al.	2015-04-30
Method and apparatus for multi-chip structure semiconductor package Grant 8,963,305 - Santos , et al. February 24, 2	2015-02-24
System, Method And Apparatus For Leadless Surface Mounted Semiconductor Package App 20140332941 - Viswanathan; Lakshminarayan ; et al.	2014-11-13
Semiconductor Devices That Include A Die Bonded To A Substrate With A Gold Interface Layer App 20140252586 - JANG; JIN-WOOK ; et al.	2014-09-11
Methods For Bonding A Die And A Substrate App 20140256091 - JANG; JIN-WOOK ; et al.	2014-09-11
System, method and apparatus for leadless surface mounted semiconductor package Grant 8,803,302 - Viswanathan , et al. August 12, 2	2014-08-12
Die bonding a semiconductor device Grant 8,753,983 - Jang , et al. June 17, 2	2014-06-17
Packaged leadless semiconductor device Grant 8,698,291 - Sanchez , et al. April 15, 2	2014-04-15
Method And Apparatus For Multi-chip Structure Semiconductor Package App 20140084432 - Santos; Fernando A. ; et al.	2014-03-27
System, Method And Apparatus For Leadless Surface Mounted Semiconductor Package App 20130320515 - Viswanathan; Lakshminarayan ; et al.	2013-12-05
Packaged Leadless Semiconductor Device App 20130154068 - Sanchez; Audel A. ; et al.	2013-06-20
Die Bonding A Semiconductor Device App 20110163439 - Jang; Jin-Wook ; et al.	2011-07-07
Method of assembling a semiconductor component and apparatus therefor Grant 7,101,736 - Sanchez , et al. September 5, 2	2006-09-05
Method of assembling a semiconductor component and apparatus therefor App 20060014325 - Sanchez; Audel A. ; et al.	2006-01-19

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