San Antonio; Romarico Santos

Patent Applications and Registrations

Patent applications and USPTO patent grants for San Antonio; Romarico Santos.The latest application filed is for "lead frame routed chip pads for semiconductor packages".

Company Profile

0.14.9

San Antonio; Romarico Santos - Batam Island ID
San Antonio; Romarico Santos - Bulacan PH
San Antonio, Romarico Santos - Batam Center ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lead frame routed chip pads for semiconductor packages Grant 8,304,864 - San Antonio , et al. November 6, 2	2012-11-06
No lead package with heat spreader Grant 8,022,512 - Ramos , et al. September 20, 2	2011-09-20
Lead Frame Routed Chip Pads For Semiconductor Packages App 20110001224 - San Antonio; Romarico Santos ; et al.	2011-01-06
Lead frame routed chip pads for semiconductor packages Grant 7,820,480 - Islam , et al. October 26, 2	2010-10-26
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 7,799,611 - Ramos , et al. September 21, 2	2010-09-21
Lead frame routed chip pads for semiconductor packages Grant 7,795,710 - Islam , et al. September 14, 2	2010-09-14
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 7,790,500 - Ramos , et al. September 7, 2	2010-09-07
Method of making thermally enhanced substrate-base package Grant 7,741,158 - Leung , et al. June 22, 2	2010-06-22
Method of making flip-chip package with underfill Grant 7,700,414 - San Antonio , et al. April 20, 2	2010-04-20
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 7,622,332 - Islam , et al. November 24, 2	2009-11-24
Partially patterned lead frames and methods of making and using the same in semiconductor packaging App 20080258278 - Ramos; Mary Jean ; et al.	2008-10-23
Taped lead frames and methods of making and using the same in semiconductor packaging Grant 7,439,097 - Islam , et al. October 21, 2	2008-10-21
Lead frame routed chip pads for semiconductor packages App 20080076206 - Islam; Shafidul ; et al.	2008-03-27
Method of making thermally enhanced substrate-base package App 20070284733 - Leung; Timothy ; et al.	2007-12-13
Die pad for semiconductor packages and methods of making and using same Grant 7,262,491 - Islam , et al. August 28, 2	2007-08-28
Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging App 20070052076 - Ramos; Mary Jean ; et al.	2007-03-08
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 7,129,116 - Islam , et al. October 31, 2	2006-10-31
Taped lead frames and methods of making and using the same in semiconductor packaging App 20060001130 - Islam; Shafidul ; et al.	2006-01-05
Partially patterned lead frames and methods of making and using the same in semiconductor packaging App 20050006737 - Islam, Shafidul ; et al.	2005-01-13
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 6,812,552 - Islam , et al. November 2, 2	2004-11-02
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 6,777,265 - Islam , et al. August 17, 2	2004-08-17
Taped lead frames and methods of making and using the same in semiconductor packaging App 20040058478 - Islam, Shafidul ; et al.	2004-03-25
Partially patterned lead frames and methods of making and using the same in semiconductor packaging App 20030203539 - Islam, Shafidul ; et al.	2003-10-30

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