loadpatents
name:-0.012259006500244
name:-0.012932777404785
name:-0.00045490264892578
Samukawa; Hiroshi Patent Filings

Samukawa; Hiroshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Samukawa; Hiroshi.The latest application filed is for "light emitting element module and method for sealing light emitting element".

Company Profile
0.9.9
  • Samukawa; Hiroshi - Tochigi JP
  • Samukawa; Hiroshi - Kanuma-shi JP
  • Samukawa; Hiroshi - Kanuma JP
  • Samukawa; Hiroshi - Kanagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Encapsulant material for optical component and light-emitting device
Grant 8,076,437 - Hatsuda , et al. December 13, 2
2011-12-13
Light emitting element module and method for sealing light emitting element
Grant 8,072,139 - Hatsuda , et al. December 6, 2
2011-12-06
Encapsulating resin composition and light-emitting device
Grant 8,022,126 - Hatsuda , et al. September 20, 2
2011-09-20
Curable resin composition
Grant 7,868,109 - Samukawa , et al. January 11, 2
2011-01-11
Light Emitting Element Module And Method For Sealing Light Emitting Element
App 20100140654 - Hatsuda; Kouki ;   et al.
2010-06-10
Non-aqueous electrolyte battery pack comprising a liquid-absorbent composition
Grant 7,732,078 - Nomura , et al. June 8, 2
2010-06-08
Encapsulant Material For Optical Component And Light-emitting Device
App 20100059774 - Hatsuda; Kouki ;   et al.
2010-03-11
Curable Resin Composition
App 20090143505 - Samukawa; Hiroshi ;   et al.
2009-06-04
Curable resin composition
Grant 7,446,159 - Samukawa , et al. November 4, 2
2008-11-04
Process For Producing Polyimide Fine Particle
App 20080269457 - Samukawa; Hiroshi
2008-10-30
Encapsulating resin composition and light-emitting device
App 20080114100 - Hatsuda; Kouki ;   et al.
2008-05-15
Etching solutions and processes for manufacturing flexible wiring boards
App 20070039921 - Samukawa; Hiroshi
2007-02-22
Etching solutions and processes for manufacturing flexible wiring boards
Grant 7,144,817 - Samukawa December 5, 2
2006-12-05
Liquid-absorbeng composition, liquid-absorbeng sheet, and nonaqueous electrolyte battery pack
App 20060022634 - Nomura; Mamiko ;   et al.
2006-02-02
lowly-adhesive coating material
App 20030049441 - Samukawa, Hiroshi
2003-03-13
Etching solutions and processes for manufacturing flexible wiring boards
App 20020030178 - Samukawa, Hiroshi
2002-03-14
Unsaturated epoxy ester with quaternary ammonium and phosphate groups
Grant 5,512,607 - Kinashi , et al. April 30, 1
1996-04-30
Photocurable self-retainable gel, shaped article prepared therefrom, applications and preparations thereof
Grant 5,426,008 - Hagiwara , et al. June 20, 1
1995-06-20

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed