SAMSUNG ELECTRO-MECANICS CO., LTD.
Patent Applications and Registrations
Patent applications and USPTO patent grants for SAMSUNG ELECTRO-MECANICS CO., LTD..The latest application filed is for "wafer level package and wafer level packaging method".
- SAMSUNG ELECTRO-MECANICS CO., LTD. - Suwon-Si Gyeonggi-Do KR
- SAMSUNG ELECTRO-MECANICS CO., LTD. - Suwon KR
| Patent | Date |
|---|---|
| Multilayer ceramic electronic part and method of manufacturing the same Grant 9,336,952 - Chung , et al. May 10, 2 | 2016-05-10 |
| Wafer level package and wafer level packaging method App 20080283989 - Jeung; Won Kyu ; et al. | 2008-11-20 |
| Method for manufacturing metal nanoparticles App 20080087137 - Shim; In-Keun ; et al. | 2008-04-17 |
| Core-shell structure metal nanoparticles and its manufacturing method App 20070212562 - Shim; In-Keun ; et al. | 2007-09-13 |
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