Sampei; Takashi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sampei; Takashi.The latest application filed is for "laser processing apparatus and laser processing method".
- Sampei; Takashi - Tokyo JP
- Sampei; Takashi - Saitama Pref. N/A JP
| Patent | Date |
|---|---|
| Laser machining apparatus Grant 10,532,430 - Sampei Ja | 2020-01-14 |
| Laser processing apparatus and laser processing method Grant 10,406,631 - Sampei , et al. Sept | 2019-09-10 |
| Laser Processing Apparatus And Laser Processing Method App 20180339365 - Sampei; Takashi ; et al. | 2018-11-29 |
| Laser processing apparatus Grant 9,724,783 - Odagiri , et al. August 8, 2 | 2017-08-08 |
| Method of dividing plate-shaped workpieces Grant 9,685,378 - Yoshikawa , et al. June 20, 2 | 2017-06-20 |
| Method Of Dividing Plate-shaped Workpieces App 20170076985 - Yoshikawa; Toshiyuki ; et al. | 2017-03-16 |
| Laser Machining Apparatus App 20160207145 - Sampei; Takashi | 2016-07-21 |
| Laser Processing Apparatus App 20160151857 - Odagiri; Wataru ; et al. | 2016-06-02 |
| Optical code detection with image exposure control Grant 8,403,220 - Fukuba , et al. March 26, 2 | 2013-03-26 |
| Optical Code Detection With Image Exposure Control App 20110210174 - Fukuba; Ken ; et al. | 2011-09-01 |
| Method and Apparatus for Imaging a Moving Object App 20100329657 - Hosoi; Kazukuni ; et al. | 2010-12-30 |
| Method for applying resin film to face of semiconductor wafer Grant 7,799,700 - Iizuka , et al. September 21, 2 | 2010-09-21 |
| Method for applying resin film to face of semiconductor wafer App 20070054498 - Iizuka; Kentaro ; et al. | 2007-03-08 |
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