Samoilov; Arkadii V.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Samoilov; Arkadii V..The latest application filed is for "optical diagnostic sensor systems and methods".

Company Profile

4.78.67

Samoilov; Arkadii V. - Saratoga CA
Samoilov; Arkadii V. - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Optical Diagnostic Sensor Systems And Methods App 20210038080 - Easson; Craig Alexander ; et al.	2021-02-11
Optical sensor packages employing cloaking layers Grant 10,475,937 - Jones , et al. Nov	2019-11-12
MEMS-based wafer level packaging for thermo-electric IR detectors Grant 10,439,118 - Emadi , et al. O	2019-10-08
High-resolution electric field sensor in cover glass Grant 10,268,864 - Withers , et al.	2019-04-23
Fully integrated gas concentration sensor Grant 10,168,211 - Emadi , et al. J	2019-01-01
Ultraviolet sensor having filter Grant 10,132,679 - Emadi , et al. November 20, 2	2018-11-20
Wafer-level package device Grant 9,966,350 - Ullal , et al. May 8, 2	2018-05-08
Fully integrated gas concentration sensor Grant 9,851,250 - Emadi , et al. December 26, 2	2017-12-26
Enhanced board level reliability for wafer level packages Grant 9,837,368 - Harper , et al. December 5, 2	2017-12-05
Wafer level device and method with cantilever pillar structure Grant 9,806,047 - Thambidurai , et al. October 31, 2	2017-10-31
Fan-out and heterogeneous packaging of electronic components Grant 9,704,809 - Tran , et al. July 11, 2	2017-07-11
Semiconductor device having a die and through-substrate via Grant 9,659,900 - Ying , et al. May 23, 2	2017-05-23
High-resolution Electric Field Sensor In Cover Glass App 20170091513 - Withers; Richard S. ; et al.	2017-03-30
Solder fatigue arrest for wafer level package Grant 9,583,425 - Xu , et al. February 28, 2	2017-02-28
High-resolution electric field sensor in cover glass Grant 9,558,390 - Withers , et al. January 31, 2	2017-01-31
Light sensor having transparent substrate and through-substrate vias and a contiguous IR suppression filter Grant 9,472,586 - Kerness , et al. October 18, 2	2016-10-18
Light sensor having a contiguous IR suppression filter and transparent substrate Grant 9,472,696 - Kerness , et al. October 18, 2	2016-10-18
Wafer-level package device with solder bump reinforcement Grant 9,425,160 - Alvarado , et al. August 23, 2	2016-08-23
Mems-based Wafer Level Packaging For Thermo-electric Ir Detectors App 20160163942 - Emadi; Arvin ; et al.	2016-06-09
Wafer level lens in package Grant 9,354,111 - Kerness , et al. May 31, 2	2016-05-31
Stacked wafer-level package device Grant 9,343,430 - Samoilov , et al. May 17, 2	2016-05-17
Multichip wafer level package (WLP) optical device Grant 9,322,901 - Kerness , et al. April 26, 2	2016-04-26
Semiconductor Device Having A Die And Through-substrate Via App 20160079197 - Ying; Xuejun ; et al.	2016-03-17
High-resolution Electric Field Sensor In Cover Glass App 20160026842 - Withers; Richard S. ; et al.	2016-01-28
Multi-die, high current wafer level package Grant 9,230,903 - Samoilov , et al. January 5, 2	2016-01-05
Lid Assembly For Thermopile Temperature Sensing Device In Thermal Gradient Environment App 20150380627 - Emadi; Arvin ; et al.	2015-12-31
Semiconductor device having a through-substrate via Grant 9,224,714 - Samoilov , et al. December 29, 2	2015-12-29
Light sensor having transparent substrate and diffuser formed therein Grant 9,224,884 - Kerness , et al. December 29, 2	2015-12-29
Light sensor having transparent substrate with lens formed therein Grant 9,224,890 - Kerness , et al. December 29, 2	2015-12-29
Ultraviolet Sensor Having Filter App 20150338273 - Emadi; Arvin ; et al.	2015-11-26
Semiconductor device having a die and through substrate-via Grant 9,196,587 - Ying , et al. November 24, 2	2015-11-24
Multi-die, High Current Wafer Level Package App 20150325512 - Samoilov; Arkadii V. ; et al.	2015-11-12
Wafer-level packaged device having self-assembled resilient leads Grant 9,159,684 - Lo , et al. October 13, 2	2015-10-13
Wafer Level Device And Method With Cantilever Pillar Structure App 20150279799 - Thambidurai; Karthik ; et al.	2015-10-01
Enhanced Board Level Reliability For Wafer Level Packages App 20150255413 - Harper; Peter R. ; et al.	2015-09-10
Semiconductor device having a through-substrate via Grant 9,105,750 - Samoilov , et al. August 11, 2	2015-08-11
Integrated circuit device having extended under ball metallization Grant 9,093,333 - Xu , et al. July 28, 2	2015-07-28
Multi-die, high current wafer level package Grant 9,087,779 - Samoilov , et al. July 21, 2	2015-07-21
Wafer-level package device having solder bump assemblies that include an inner pillar structure Grant 9,087,732 - Xu , et al. July 21, 2	2015-07-21
Wafer Level Lens In Package App 20150109785 - Kerness; Nicole D. ; et al.	2015-04-23
Light Sensor Having Transparent Substrate And Diffuser Formed Therein App 20140284748 - Kerness; Nicole D. ; et al.	2014-09-25
Semiconductor Device Having A Through-substrate Via App 20140284793 - Samoilov; Arkadii V. ; et al.	2014-09-25
Semiconductor Device Having A Die And Through Substrate-via App 20140264844 - Ying; Xuejun ; et al.	2014-09-18
Fan-out And Heterogeneous Packaging Of Electronic Components App 20140252655 - Tran; Khanh ; et al.	2014-09-11
Multichip Wafer Level Package (wlp) Optical Device App 20140231635 - Kerness; Nicole D. ; et al.	2014-08-21
Light sensor having a contiguous IR suppression filter and a transparent substrate Grant 8,803,068 - Kerness , et al. August 12, 2	2014-08-12
Light sensor having a transparent substrate, a contiguous IR suppression filter and through-substrate vias Grant 8,791,404 - Kerness , et al. July 29, 2	2014-07-29
Light sensor having transparent substrate with lens formed therein Grant 8,779,540 - Kerness , et al. July 15, 2	2014-07-15
Multi-die, High Current Wafer Level Package App 20140183747 - Samoilov; Arkadii V. ; et al.	2014-07-03
Light sensor having transparent substrate and diffuser formed therein Grant 8,749,007 - Kerness , et al. June 10, 2	2014-06-10
Semiconductor device having a through-substrate via Grant 8,748,232 - Samoilov , et al. June 10, 2	2014-06-10
Semiconductor device having a through-substrate via Grant 8,742,574 - Samoilov , et al. June 3, 2	2014-06-03
Solder Fatigue Arrest For Wafer Level Package App 20140131859 - Xu; Yong Li ; et al.	2014-05-15
Wafer-level packaged device having self-assembled resilient leads Grant 8,692,367 - Lo , et al. April 8, 2	2014-04-08
Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress Grant 8,686,560 - Parvarandeh , et al. April 1, 2	2014-04-01
Three-dimensional Semiconductor Package Device Having Enhanced Security App 20140077355 - Harper; Peter R. ; et al.	2014-03-20
Use of CL2 and/or HCL during silicon epitaxial film formation Grant 8,586,456 - Ye , et al. November 19, 2	2013-11-19
Semiconductor Device Having A Through-substrate Via App 20130168850 - Samoilov; Arkadii V. ; et al.	2013-07-04
Etchant treatment processes for substrate surfaces and chamber surfaces Grant 8,445,389 - Zojaji , et al. May 21, 2	2013-05-21
Light sensor using wafer-level packaging Grant 8,405,115 - Samoilov , et al. March 26, 2	2013-03-26
Stacked Wafer-level Package Device App 20130056866 - Samoilov; Arkadii V. ; et al.	2013-03-07
Semiconductor Device Having A Through-substrate Via App 20130037948 - Samoilov; Arkadii V. ; et al.	2013-02-14
Wafer-level Package Device App 20120306071 - Ullal; Vijay ; et al.	2012-12-06
Wafer-level packaged device having self-assembled resilient leads Grant 8,278,748 - Lo , et al. October 2, 2	2012-10-02
Wafer level package (WLP) device having bump assemblies including a barrier metal Grant 8,259,464 - Zhou , et al. September 4, 2	2012-09-04
Light Sensor Having Transparent Substrate And Through-substrate Vias App 20120187281 - Kerness; Nicole D. ; et al.	2012-07-26
Light Sensor Having Ir Suppression Filter And Transparent Substrate App 20120187280 - Kerness; Nicole D. ; et al.	2012-07-26
Light Sensor Having Transparent Substrate With Lens Formed Therein App 20120187515 - Kerness; Nicole D. ; et al.	2012-07-26
Etchant Treatment Processes For Substrate Surfaces And Chamber Surfaces App 20120108039 - Zojaji; Ali ; et al.	2012-05-03
Low Temperature Etchant For Treatment Of Silicon-containing Surfaces App 20120070961 - Samoilov; Arkadii V.	2012-03-22
Etchant treatment processes for substrate surfaces and chamber surfaces Grant 8,093,154 - Zojaji , et al. January 10, 2	2012-01-10
Wafer Level Package (wlp) Device Having Bump Assemblies Including A Barrier Metal App 20110317385 - Zhou; Tiao ; et al.	2011-12-29
Cluster Tool For Epitaxial Film Formation App 20110290176 - Samoilov; Arkadii V.	2011-12-01
Wafer-level Chip-scale Package Device Having Bump Assemblies Configured To Mitigate Failures Due To Stress App 20110248398 - PARVARANDEH; PIROOZ ; et al.	2011-10-13
Use Of Cl2 And/or Hcl During Silicon Epitaxial Film Formation App 20110230036 - Ye; Zhiyuan ; et al.	2011-09-22
Wafer-level Packaged Device Having Self-assembled Resilient Leads App 20110198745 - Lo; Chiung C. ; et al.	2011-08-18
Use of CL2 and/or HCL during silicon epitaxial film formation Grant 7,960,256 - Ye , et al. June 14, 2	2011-06-14
Method for fabricating waveguides Grant 7,871,469 - Maydan , et al. January 18, 2	2011-01-18
Formation and treatment of epitaxial layer containing silicon and carbon Grant 7,837,790 - Kim , et al. November 23, 2	2010-11-23
Use Of Cl2 And/or Hcl During Silicon Epitaxial Film Formation App 20100221902 - Ye; Zhiyuan ; et al.	2010-09-02
Light Sensor Using Wafer-Level Packaging App 20100187557 - Samoilov; Arkadii V. ; et al.	2010-07-29
Methods to fabricate MOSFET devices using a selective deposition process Grant 7,737,007 - Samoilov , et al. June 15, 2	2010-06-15
Use of Cl2 and/or HCl during silicon epitaxial film formation Grant 7,732,305 - Ye , et al. June 8, 2	2010-06-08
High-Electrical-Current Wafer Level Packaging, High-Electrical-Current WLP Electronic Devices, and Methods of Manufacture Thereof App 20100072615 - Samoilov; Arkadii V. ; et al.	2010-03-25
Use of Cl2 and/or HCl during silicon epitaxial film formation Grant 7,682,940 - Ye , et al. March 23, 2	2010-03-23
Gas manifolds for use during epitaxial film formation Grant 7,674,337 - Ishikawa , et al. March 9, 2	2010-03-09
Carbon precursors for use during silicon epitaxial film formation Grant 7,598,178 - Samoilov , et al. October 6, 2	2009-10-06
Selective epitaxy process with alternating gas supply Grant 7,572,715 - Kim , et al. August 11, 2	2009-08-11
Selective epitaxy process with alternating gas supply Grant 7,521,365 - Kim , et al. April 21, 2	2009-04-21
Methods of selective deposition of heavily doped epitaxial SiGe Grant 7,517,775 - Kim , et al. April 14, 2	2009-04-14
Methods To Fabricate Mosfet Devices Using A Selective Deposition Process App 20090011578 - SAMOILOV; ARKADII V. ; et al.	2009-01-08
Methods to fabricate MOSFET devices using a selective deposition process Grant 7,439,142 - Samoilov , et al. October 21, 2	2008-10-21
Formation And Treatment Of Epitaxial Layer Containing Silicon And Carbon App 20080132018 - KIM; YIHWAN ; et al.	2008-06-05
Carbon Precursors For Use During Silicon Epitaxial Film Formation App 20080044932 - SAMOILOV; ARKADII V. ; et al.	2008-02-21
Selective epitaxy process with alternating gas supply Grant 7,312,128 - Kim , et al. December 25, 2	2007-12-25
Cluster Tool For Epitaxial Film Formation App 20070286956 - SAMOILOV; ARKADII V.	2007-12-13
Gas Manifolds For Use During Epitaxial Film Formation App 20070259112 - Ishikawa; David ; et al.	2007-11-08
Low Temperature Etchant For Treatment Of Silicon-containing Surfaces App 20070224830 - SAMOILOV; ARKADII V.	2007-09-27
Selective Epitaxy Process With Alternating Gas Supply App 20070207596 - Kim; Yihwan ; et al.	2007-09-06
Low temperature etchant for treatment of silicon-containing surfaces Grant 7,235,492 - Samoilov June 26, 2	2007-06-26
Methods To Fabricate Mosfet Devices Using A Selective Deposition Process App 20070082451 - SAMOILOV; ARKADII V. ; et al.	2007-04-12
Methods of selective deposition of heavily doped epitaxial SiGe Grant 7,166,528 - Kim , et al. January 23, 2	2007-01-23
Use of Cl2 and/or HCl during silicon epitaxial film formation App 20060260538 - Ye; Zhiyuan ; et al.	2006-11-23
Methods to fabricate MOSFET devices using selective deposition process Grant 7,132,338 - Samoilov , et al. November 7, 2	2006-11-07
METHODS OF SELECTIVE DEPOSITION OF HEAVILY DOPED EPITAXIAL SiGe App 20060234488 - Kim; Yihwan ; et al.	2006-10-19
Selective Epitaxy Process With Alternating Gas Supply App 20060216876 - Kim; Yihwan ; et al.	2006-09-28
Low temperature etchant for treatment of silicon-containing surfaces App 20060169668 - Samoilov; Arkadii V.	2006-08-03
Etchant treatment processes for substrate surfaces and chamber surfaces App 20060169669 - Zojaji; Ali ; et al.	2006-08-03
Use of CL2 and/or HCL during silicon epitaxial film formation App 20060115933 - Ye; Zhiyuan ; et al.	2006-06-01
Selective epitaxy process with alternating gas supply App 20060115934 - Kim; Yihwan ; et al.	2006-06-01
Method for CVD process control for enhancing device performance Grant 6,911,401 - Khandan , et al. June 28, 2	2005-06-28
Waveguides such as SiGeC waveguides and method of fabricating the same Grant 6,905,542 - Samoilov , et al. June 14, 2	2005-06-14
Methods of selective deposition of heavily doped epitaxial SiGe App 20050079691 - Kim, Yihwan ; et al.	2005-04-14
Methods to fabricate MOSFET devices using selective deposition process App 20050079692 - Samoilov, Arkadii V. ; et al.	2005-04-14
Method of calibrating and using a semiconductor processing system Grant 6,876,442 - Vatus , et al. April 5, 2	2005-04-05
Method for fabricating waveguides App 20040237883 - Maydan, Dan ; et al.	2004-12-02
Method for fabricating waveguides Grant 6,770,134 - Maydan , et al. August 3, 2	2004-08-03
Method for CVD process control for enhancing device performance App 20040133361 - Khandan, Shahab ; et al.	2004-07-08
Method for fabricating an ultra shallow junction of a field effect transistor App 20040072446 - Liu, Wei ; et al.	2004-04-15
Apparatus and method for delivering process gas to a substrate processing system App 20040050325 - Samoilov, Arkadii V. ; et al.	2004-03-18
Method of calibrating and using a semiconductor processing system App 20030151733 - Vatus, Jean R. ; et al.	2003-08-14
Process and apparatus for cleaning a silicon surface Grant 6,494,959 - Samoilov , et al. December 17, 2	2002-12-17
Method and apparatus for detecting the thickness of copper oxide App 20020186381 - Subrahmanyan, Suchitra ; et al.	2002-12-12
Method for fabricating waveguides App 20020174826 - Maydan, Dan ; et al.	2002-11-28
Waveguides such as SiGeC waveguides and method of fabricating the same App 20020174827 - Samoilov, Arkadii V. ; et al.	2002-11-28
Process and apparatus for cleaning a silicon surface App 20020166256 - Samoilov, Arkadii V. ; et al.	2002-11-14
Backside heating chamber for emissivity independent thermal processes Grant 6,455,814 - Samoilov , et al. September 24, 2	2002-09-24
Method for CVD process control for enhancing device performance App 20020039803 - Khandan, Shahab ; et al.	2002-04-04
Method for CVD process control for enhancing device performance Grant 6,342,453 - Khandan , et al. January 29, 2	2002-01-29