Sammon; Tim

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sammon; Tim.The latest application filed is for "embedded power management control circuit".

Company Profile

0.8.9

Sammon; Tim - Empingham GB
Sammon; Tim - Helensburgh GB
Sammon; Tim - East Sussex GB
Sammon, Tim - Hove GB

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Power MOSFET with integrated drivers in a common package Grant RE41,719 - Kinzer , et al. September 21, 2	2010-09-21
Battery protection circuit with integrated passive components Grant 7,274,100 - Pavier , et al. September 25, 2	2007-09-25
Integrated semiconductor power device for multiple battery systems Grant 7,034,344 - Pavier , et al. April 25, 2	2006-04-25
Embedded power management control circuit App 20050207133 - Pavier, Mark ; et al.	2005-09-22
Clip-type lead frame for source mounted die Grant 6,924,175 - Pavier , et al. August 2, 2	2005-08-02
Plural semiconductor devices in monolithic flip chip Grant 6,894,397 - Pavier , et al. May 17, 2	2005-05-17
Integrated semiconductor power device for multiple battery systems App 20050006750 - Pavier, Mark ; et al.	2005-01-13
Battery protection circuit with integrated passive components App 20040256738 - Pavier, Mark ; et al.	2004-12-23
Clip-type lead frame for source mounted die App 20040147061 - Pavier, Mark ; et al.	2004-07-29
Clip-type lead frame for source mounted die Grant 6,717,260 - Pavier , et al. April 6, 2	2004-04-06
Vertical conduction flip-chip device with bump contacts on single surface Grant 6,653,740 - Kinzer , et al. November 25, 2	2003-11-25
Power mosfet with integrated drivers in a common package Grant 6,593,622 - Kinzer , et al. July 15, 2	2003-07-15
Plural semiconductor devices in monolithic flip chip App 20030062622 - Pavier, Mark ; et al.	2003-04-03
Power mosfet with integrated drivers in a common package App 20020163040 - Kinzer, Daniel M. ; et al.	2002-11-07
Clip-type lead frame for source mounted die App 20020096749 - Pavier, Mark ; et al.	2002-07-25
Semiconductor device package and lead frame with die overhanging lead frame pad App 20020047198 - Sammon, Tim	2002-04-25
Vertical conduction flip-chip device with bump contacts on single surface App 20010045635 - Kinzer, Daniel M. ; et al.	2001-11-29

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