loadpatents
name:-0.0028719902038574
name:-0.013570070266724
name:-0.0015110969543457
Sammakia; Bahgat G. Patent Filings

Sammakia; Bahgat G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sammakia; Bahgat G..The latest application filed is for "method and pattern of dispensing thermal interface materials".

Company Profile
0.11.0
  • Sammakia; Bahgat G. - Binghamton NY US
  • Sammakia; Bahgat G. - Newark Valley NY
  • Sammakia; Bahgat G. - Johnson City NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method and pattern of dispensing thermal interface materials
Grant 8,851,159 - Davidson , et al. October 7, 2
2014-10-07
Method and pattern of dispensing thermal interface materials
Grant 8,481,103 - Davidson , et al. July 9, 2
2013-07-09
Electronic package having active means to maintain its operating temperature constant
Grant 5,491,610 - Mok , et al. February 13, 1
1996-02-13
Method and apparatus for testing of integrated circuit chips
Grant 5,420,520 - Anschel , et al. May 30, 1
1995-05-30
Pluggable electronic circuit package assembly with snap together heat sink housing
Grant 5,109,318 - Funari , et al. April 28, 1
1992-04-28
Epoxy composition and use thereof
Grant 5,028,984 - Ameen , et al. July 2, 1
1991-07-02
Electronic assembly with enhanced heat sinking
Grant 5,003,429 - Baker , et al. March 26, 1
1991-03-26
Electronic package with heat spreader member
Grant 4,914,551 - Anschel , et al. April 3, 1
1990-04-03
Electronic package with improved heat sink
Grant 4,849,856 - Funari , et al. July 18, 1
1989-07-18

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