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name:-0.027381896972656
name:-0.016694068908691
name:-0.00058197975158691
Sameshima; Katsumi Patent Filings

Sameshima; Katsumi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sameshima; Katsumi.The latest application filed is for "semiconductor device".

Company Profile
0.17.14
  • Sameshima; Katsumi - Kyoto JP
  • Sameshima, Katsumi - Kyoto-shi JP
  • Sameshima, Katsumi - Kyoto-ku JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device
Grant 9,941,231 - Sameshima April 10, 2
2018-04-10
Semiconductor Device
App 20170179060 - SAMESHIMA; Katsumi
2017-06-22
Semiconductor device
Grant 9,607,957 - Sameshima March 28, 2
2017-03-28
Semiconductor Device
App 20160351519 - SAMESHIMA; Katsumi
2016-12-01
Semiconductor device
Grant 9,437,544 - Sameshima September 6, 2
2016-09-06
Semiconductor Device
App 20150228575 - SAMESHIMA; Katsumi
2015-08-13
Semiconductor device
Grant 9,035,455 - Sameshima May 19, 2
2015-05-19
Semiconductor device and semiconductor device manufacturing method
Grant 8,125,084 - Nakagawa , et al. February 28, 2
2012-02-28
Semiconductor Device And Semiconductor Device Manufacturing Method
App 20100032837 - Nakagawa; Ryosuke ;   et al.
2010-02-11
Plating apparatus
Grant 7,632,382 - Saito , et al. December 15, 2
2009-12-15
Semiconductor Device
App 20090127709 - SAMESHIMA; Katsumi
2009-05-21
Semiconductor chip and production process therefor
App 20080138976 - Kumamoto; Nobuhisa ;   et al.
2008-06-12
Substrate holding apparatus
Grant 7,156,720 - Saito , et al. January 2, 2
2007-01-02
Method of dressing polishing pad and polishing apparatus
Grant 7,066,786 - Fujishima , et al. June 27, 2
2006-06-27
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device
Grant 7,045,900 - Hikita , et al. May 16, 2
2006-05-16
Plating apparatus
App 20050274604 - Saito, Koji ;   et al.
2005-12-15
Plating apparatus
App 20050250324 - Saito, Koji ;   et al.
2005-11-10
Substrate holding apparatus
App 20050208880 - Saito, Koji ;   et al.
2005-09-22
Ferroelectric memory and method for manufacturing same
Grant 6,900,486 - Sameshima May 31, 2
2005-05-31
Method of dressing polishing pad and polishing apparatus
App 20050090185 - Fujishima, Tatsuya ;   et al.
2005-04-28
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device
App 20040222521 - Hikita, Junichi ;   et al.
2004-11-11
Semiconductor chip and production process therefor
App 20040183208 - Kumamoto, Nobuhisa ;   et al.
2004-09-23
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device
Grant 6,724,084 - Hikita , et al. April 20, 2
2004-04-20
Semiconductor chip and semiconductor device of chip-on-chip structure
Grant 6,657,309 - Hikita , et al. December 2, 2
2003-12-02
Ferroelectric memory and method for manufacturing same
Grant 6,656,747 - Sameshima December 2, 2
2003-12-02
Ferroelectric Memory Device And Method For Manufacturing Same
App 20020036305 - SAMESHIMA, KATSUMI
2002-03-28
Ferroelectric memory and method for manufacturing same
App 20020005532 - Sameshima, Katsumi
2002-01-17
Capacitor using dielectric film
Grant 5,777,839 - Sameshima , et al. July 7, 1
1998-07-07
Semiconductor storage device having ferroelectric film
Grant 5,384,729 - Sameshima January 24, 1
1995-01-24
Method and apparatus for depositing an oxide film
Grant 5,332,482 - Sameshima July 26, 1
1994-07-26

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