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Reduced electromigration and stressed induced migration of copper wires by surface coating
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Ball Limiting Metallurgy, Interconnection Structure Including the Same, and Method of Forming an Interconnection Structure
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Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
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Self-aligned corrosion stop for copper C4 and wirebond
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Means of seeding and metallizing polyimide
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Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
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Self-aligned corrosion stop for copper C4 and wirebond
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Self-aligned corrosion stop for copper C4 and wirebond
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Method for testing chips on flat solder bumps
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Method for testing chips on flat solder bumps
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Method for forming encapsulated metal interconnect structures in semiconductor integrated circuit devices
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Method for direct chip attach by solder bumps and an underfill layer
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Self-aligned corrosion stop for copper C4 and wirebond
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Process to increase reliability CuBEOL structures
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Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond
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Electroless metal liner formation methods
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Method for direct chip attach by solder bumps and an underfill layer
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Method of forming barrier layers for damascene interconnects
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Method for direct chip attach by solder bumps and an underfill layer
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Method for preparing a conductive pad for electrical connection and conductive pad formed
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Manufacturing computer systems with fine line circuitized substrates
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Manufacturing computer systems with fine line circuitized substrates
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Lead free conductive composites for electrical interconnections
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Dual etch stop/diffusion barrier for damascene interconnects
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Depositing a conductive metal onto a substrate
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Electroless metal adhesion to organic dielectric material with phase separated morphology
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High performance metal cone contact
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