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name:-0.029497146606445
name:-0.019562005996704
name:-0.0090410709381104
Samadi; Kambiz Patent Filings

Samadi; Kambiz

Patent Applications and Registrations

Patent applications and USPTO patent grants for Samadi; Kambiz.The latest application filed is for "hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro".

Company Profile
8.17.22
  • Samadi; Kambiz - San Diego CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro
Grant 11,004,780 - Samadi , et al. May 11, 2
2021-05-11
Hard Macro Having Blockage Sites, Integrated Circuit Including Same And Method Of Routing Through A Hard Macro
App 20200105652 - Samadi; Kambiz ;   et al.
2020-04-02
Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro
Grant 10,510,651 - Samadi , et al. Dec
2019-12-17
Device Comprising Integration Of Die To Die With Polymer Planarization Layer
App 20190259677 - LASITER; Jon ;   et al.
2019-08-22
Hard Macro Having Blockage Sites, Integrated Circuit Including Same And Method Of Routing Through A Hard Macro
App 20190122973 - Samadi; Kambiz ;   et al.
2019-04-25
Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro
Grant 10,192,813 - Samadi , et al. Ja
2019-01-29
Power Distribution Networks For A Three-dimensional (3d) Integrated Circuit (ic) (3dic)
App 20190027435 - Kamal; Pratyush ;   et al.
2019-01-24
Multi-processor core three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods
Grant 10,176,147 - Samadi , et al. J
2019-01-08
Power distribution networks for a three-dimensional (3D) integrated circuit (IC) (3DIC)
Grant 10,121,743 - Kamal , et al. November 6, 2
2018-11-06
Power Distribution Networks For A Three-dimensional (3d) Integrated Circuit (ic) (3dic)
App 20180286800 - Kamal; Pratyush ;   et al.
2018-10-04
MULTI-PROCESSOR CORE THREE-DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs), AND RELATED METHODS
App 20180260360 - Samadi; Kambiz ;   et al.
2018-09-13
Connection propagation for inter-logical block connections in integrated circuits
Grant 9,929,733 - Kamal , et al. March 27, 2
2018-03-27
Power gate placement techniques in three-dimensional (3D) integrated circuits (ICs) (3DICs)
Grant 9,754,923 - Xie , et al. September 5, 2
2017-09-05
Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC)
Grant 9,741,691 - Lim , et al. August 22, 2
2017-08-22
Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms
Grant 9,626,311 - Lim , et al. April 18, 2
2017-04-18
Techniques for implementing a synthetic jet to cool a device
Grant 9,629,233 - Saeidi , et al. April 18, 2
2017-04-18
Enhancement Of Chip Thermal Performance Through Silicon Thermal Conductivity Modulation
App 20170092558 - MITTAL; Arpit ;   et al.
2017-03-30
Techniques For Implementing A Synthetic Jet To Cool A Device
App 20160360606 - SAEIDI; Mehdi ;   et al.
2016-12-08
Clock tree synthesis for low cost pre-bond testing of 3D integrated circuits
Grant 9,508,615 - Lim , et al. November 29, 2
2016-11-29
Power Delivery Network (pdn) Design For Monolithic Three-dimensional (3-d) Integrated Circuit (ic)
App 20160322331 - LIM; Sung Kyu ;   et al.
2016-11-03
Intellectual property block design with folded blocks and duplicated pins for 3D integrated circuits
Grant 9,483,598 - Lim , et al. November 1, 2
2016-11-01
Clock Tree Synthesis For Low Cost Pre-bond Testing Of 3d Integrated Circuits
App 20160233134 - LIM; Sung Kyu ;   et al.
2016-08-11
Intellectual Property Block Design With Folded Blocks And Duplicated Pins For 3d Integrated Circuits
App 20160232271 - LIM; Sung Kyu ;   et al.
2016-08-11
Memory Controller Placement In A Three-dimensional (3d) Integrated Circuit (ic) (3dic) Employing Distributed Through-silicon-via (tsv) Farms
App 20160217087 - Lim; Sung Kyu ;   et al.
2016-07-28
High Quality Physical Design For Monolithic Three-dimensional Integrated Circuits (3d Ic) Using Two-dimensional Integrated Circuit (2d Ic) Design Tools
App 20160042110 - LIM; Sung Kyu ;   et al.
2016-02-11
PLACEMENT OF MONOLITHIC INTER-TIER VIAS (MIVs) WITHIN MONOLITHIC THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs) USING CLUSTERING TO INCREASE USABLE WHITESPAC
App 20150333005 - Samadi; Kambiz ;   et al.
2015-11-19
Monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) with vertical memory components, related systems and methods
Grant 9,147,438 - Kamal , et al. September 29, 2
2015-09-29
Placement of monolithic inter-tier vias (MIVs) within monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) using clustering to increase usable whitespace
Grant 9,123,721 - Samadi , et al. September 1, 2
2015-09-01
Clock distribution network for 3D integrated circuit
Grant 9,098,666 - Samadi , et al. August 4, 2
2015-08-04
3D floorplanning using 2D and 3D blocks
Grant 9,064,077 - Samadi , et al. June 23, 2
2015-06-23
PLACEMENT OF MONOLITHIC INTER-TIER VIAS (MIVs) WITHIN MONOLITHIC THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs) USING CLUSTERING TO INCREASE USABLE WHITESPACE
App 20150145143 - Samadi; Kambiz ;   et al.
2015-05-28
Flip-flops in a monolithic three-dimensional (3D) integrated circuit (IC) (3DIC) and related methods
Grant 9,041,448 - Du , et al. May 26, 2
2015-05-26
MONOLITHIC THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs) WITH VERTICAL MEMORY COMPONENTS, RELATED SYSTEMS AND METHODS
App 20150109843 - Kamal; Pratyush ;   et al.
2015-04-23
METHODS OF DESIGNING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs) AND RELATED SYSTEMS AND COMPONENTS
App 20150112646 - Kamal; Pratyush ;   et al.
2015-04-23
DIGITAL TEMPERATURE ESTIMATORS (DTEs) DISPOSED IN INTEGRATED CIRCUITS (ICs) FOR ESTIMATING TEMPERATURE WITHIN THE ICs, AND RELATED SYSTEMS AND METHODS
App 20150103866 - Samadi; Kambiz ;   et al.
2015-04-16
Flip-flops In A Monolithic Three-dimensional (3d) Integrated Circuit (ic) (3dic) And Related Methods
App 20140253196 - Du; Yang ;   et al.
2014-09-11
Clock Distribution Network For 3d Integrated Circuit
App 20140145347 - Samadi; Kambiz ;   et al.
2014-05-29
3d Floorplanning Using 2d And 3d Blocks
App 20140149958 - Samadi; Kambiz ;   et al.
2014-05-29
Hard Macro Having Blockage Sites, Integrated Circuit Including Same And Method Of Routing Through A Hard Macro
App 20140131885 - Samadi; Kambiz ;   et al.
2014-05-15

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