Salzman; James Fred
Patent Applications and Registrations
Patent applications and USPTO patent grants for Salzman; James Fred.The latest application filed is for "flip chip backside mechanical die grounding techniques".
- Salzman; James Fred - Anna TX
| Patent | Date |
|---|---|
| Process enhancement using double sided epitaxial on substrate Grant 11,056,490 - Salzman , et al. July 6, 2 | 2021-07-06 |
| Flip chip backside die grounding techniques Grant 11,043,467 - Salzman June 22, 2 | 2021-06-22 |
| Flip Chip Backside Mechanical Die Grounding Techniques App 20200219838 - Salzman; James Fred | 2020-07-09 |
| Flip Chip Backside Die Grounding Techniques App 20200176413 - Salzman; James Fred | 2020-06-04 |
| Flip chip backside die grounding techniques Grant 10,607,958 - Salzman | 2020-03-31 |
| Flip chip backside mechanical die grounding techniques Grant 10,600,753 - Salzman | 2020-03-24 |
| Methanol slicing of wine Grant 10,428,298 - Salzman , et al. October 1, 2 | 2019-10-01 |
| Process Enhancement Using Double Sided Epitaxial On Substrate App 20190296013 - Salzman; James Fred ; et al. | 2019-09-26 |
| Process enhancement using double sided epitaxial on substrate Grant 10,304,827 - Salzman , et al. | 2019-05-28 |
| Process Enhancement Using Double Sided Epitaxial On Substrate App 20180254272 - Salzman; James Fred ; et al. | 2018-09-06 |
| Latchup reduction by grown orthogonal substrates Grant 10,043,867 - Salzman , et al. August 7, 2 | 2018-08-07 |
| Process enhancement using double sided epitaxial on substrate Grant 10,002,870 - Salzman , et al. June 19, 2 | 2018-06-19 |
| Process Enhancement Using Double Sided Epitaxial On Substrate App 20180053764 - Salzman; James Fred ; et al. | 2018-02-22 |
| Radiation Enhanced Bipolar Transistor App 20170373174 - Salzman; James Fred ; et al. | 2017-12-28 |
| Latchup Reduction By Grown Orthogonal Substrates App 20170345894 - Salzman; James Fred ; et al. | 2017-11-30 |
| Latchup reduction by grown orthogonal substrates Grant 9,741,791 - Salzman , et al. August 22, 2 | 2017-08-22 |
| Methods for fabricating radiation hardened MOS devices Grant 9,653,544 - Salzman May 16, 2 | 2017-05-16 |
| Device having improved radiation hardness and high breakdown voltages Grant 9,620,586 - Salzman April 11, 2 | 2017-04-11 |
| Flip Chip Backside Mechanical Die Grounding Techniques App 20170062377 - Salzman; James Fred | 2017-03-02 |
| Flip Chip Backside Die Grounding Techniques App 20170062376 - Salzman; James Fred | 2017-03-02 |
| Latchup Reduction By Grown Orthogonal Substrates App 20160190237 - Salzman; James Fred ; et al. | 2016-06-30 |
| Radiation Hardened MOS Devices and Methods of Fabrication App 20160163794 - Salzman; James Fred | 2016-06-09 |
| Radiation Hardened MOS Devices and Methods of Fabrication App 20160141389 - Salzman; James Fred | 2016-05-19 |
| Latchup reduction by grown orthogonal substrates Grant 9,281,245 - Salzman , et al. March 8, 2 | 2016-03-08 |
| Device having improved radiation hardness and high breakdown voltages Grant 9,281,232 - Salzman March 8, 2 | 2016-03-08 |
| Ceramic nanochannel drug delivery device and method of formation Grant 9,079,002 - Salzman July 14, 2 | 2015-07-14 |
| Radiation Hardened Mos Devices And Methods Of Fabrication App 20150108588 - Salzman; James Fred | 2015-04-23 |
| Radiation induced diode structure Grant 9,006,864 - Salzman , et al. April 14, 2 | 2015-04-14 |
| Latchup Reduction By Grown Orthogonal Substrates App 20140183707 - SALZMAN; James Fred ; et al. | 2014-07-03 |
| Radiation Induced Diode Structure App 20140124895 - SALZMAN; James Fred ; et al. | 2014-05-08 |
| Radiation hardened integrated circuit Grant 8,530,298 - Roybal , et al. September 10, 2 | 2013-09-10 |
| Extending Radiation Tolerance By Localized Temperature Annealing Of Semiconductor Devices App 20130126508 - Salzman; James Fred ; et al. | 2013-05-23 |
| Radiation Hardened Integrated Circuit App 20130105904 - ROYBAL; RICHARD G. ; et al. | 2013-05-02 |
| System and method for implementing transformer on package substrate Grant 7,453,142 - Lee , et al. November 18, 2 | 2008-11-18 |
| Inductance enhancement by magnetic material introduction App 20080084311 - Salzman; James Fred | 2008-04-10 |
| Double-sided die App 20080023824 - Salzman; James Fred | 2008-01-31 |
| System and method for implementing transformer on package substrate App 20070128821 - Lee; See Taur ; et al. | 2007-06-07 |
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