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Patent applications and USPTO patent grants for Sallo, Jerome S..The latest application filed is for "copper on polymer component having improved adhesion".
Patent | Date |
---|---|
Copper on polymer component having improved adhesion App 20030039760 - Bergstresser, Tad R. ;   et al. | 2003-02-27 |
Method for making multi-layer circuit boards Grant 5,861,076 - Adlam , et al. January 19, 1 | 1999-01-19 |
Copper-chromium-polyimide composite Grant 4,863,808 - Sallo September 5, 1 | 1989-09-05 |
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