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name:-0.022062063217163
name:-0.011749029159546
name:-0.00051712989807129
Saldana; Miguel A. Patent Filings

Saldana; Miguel A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Saldana; Miguel A..The latest application filed is for "edge ring assembly for plasma etching chambers".

Company Profile
0.10.11
  • Saldana; Miguel A. - Fremont CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Edge Ring Assembly For Plasma Etching Chambers
App 20140367047 - Kang; Michael S. ;   et al.
2014-12-18
Methods for enhanced fluid delivery on bevel etch applications
Grant 8,671,965 - Saldana , et al. March 18, 2
2014-03-18
Methods for Enhanced Fluid Delivery on Bevel Etch Applications
App 20130056078 - Saldana; Miguel A. ;   et al.
2013-03-07
Apparatus and methods for enhanced fluid delivery on bevel etch applications
Grant 8,328,980 - Saldana , et al. December 11, 2
2012-12-11
Apparatus and Methods for Enhanced Fluid Delivery on Bevel Etch Applications
App 20110059614 - Saldana; Miguel A. ;   et al.
2011-03-10
Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
Grant 7,481,695 - Saldana , et al. January 27, 2
2009-01-27
Platen with diaphragm and method for optimizing wafer polishing
Grant 7,018,273 - Kiermasz , et al. March 28, 2
2006-03-28
Methods and apparatus for optimal temperature control in a plasma processing system
App 20060000551 - Saldana; Miguel A. ;   et al.
2006-01-05
Oscillating chemical mechanical planarization apparatus
Grant 6,902,466 - Saldana , et al. June 7, 2
2005-06-07
Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film
Grant 6,752,703 - Boyd , et al. June 22, 2
2004-06-22
Active retaining ring support
Grant 6,719,874 - Gotkis , et al. April 13, 2
2004-04-13
Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
Grant 6,640,155 - Saldana , et al. October 28, 2
2003-10-28
Oscillating chemical mechanical planarization apparatus
App 20030134582 - Saldana, Miguel A. ;   et al.
2003-07-17
Subaperture chemical mechanical polishing system
Grant 6,585,572 - Saldana , et al. July 1, 2
2003-07-01
Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film
App 20030119431 - Boyd, John M. ;   et al.
2003-06-26
Oscillating fixed abrasive CMP system and methods for implementing the same
App 20030109195 - Saldana, Miguel A. ;   et al.
2003-06-12
Chemical mechanical polishing apparatus and methods with central control of polishing pressure applied by polishing head
App 20020188370 - Saldana, Miguel A. ;   et al.
2002-12-12
Polishing apparatus and methods having high processing workload for controlling polishing pressure applied by polishing head
App 20020146970 - Saldana, Miguel A. ;   et al.
2002-10-10
Adjustable force applying air platen and spindle system, and methods for using the same
App 20020142710 - Saldana, Miguel A. ;   et al.
2002-10-03

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