| Patent | Date |
|---|
Microelectronic device with embedded die substrate on interposer
Grant 11,430,740 - May , et al. August 30, 2 | 2022-08-30 |
Microelectronic Device With Embedded Die Substrate On Interposer
App 20220230965 - MAY; Robert Alan ; et al. | 2022-07-21 |
Microelectronic Device With Embedded Die Substrate On Interposer
App 20220108957 - MAY; Robert Alan ; et al. | 2022-04-07 |
Device And Method Of Very High Density Routing Used With Embedded Multi-die Interconnect Bridge
App 20210280517 - May; Robert Alan ; et al. | 2021-09-09 |
Embedded Multi-die Interconnect Bridge Packages With Lithotgraphically Formed Bumps And Methods Of Assembling Same
App 20210257303 - ALUR; Amruthavalli Pallavi ; et al. | 2021-08-19 |
Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
Grant 11,043,457 - Alur , et al. June 22, 2 | 2021-06-22 |
Embedded Multi-die Interconnect Bridge Packages With Lithotgraphically Formed Bumps And Methods Of Assembling Same
App 20200303310 - ALUR; Amruthavalli Pallavi ; et al. | 2020-09-24 |
Substrate Patch Reconstitution Options
App 20200294920 - HARIRI; Haifa ; et al. | 2020-09-17 |
Methods To Pattern Tfc And Incorporation In The Odi Architecture And In Any Build Up Layer Of Organic Substrate
App 20200294938 - JAIN; Rahul ; et al. | 2020-09-17 |
Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same
Grant 10,707,168 - Alur , et al. | 2020-07-07 |
Systems and methods for semiconductor packages using photoimageable layers
Grant 10,553,453 - Chavali , et al. Fe | 2020-02-04 |
Microelectronic Device With Embedded Die Substrate On Interposer
App 20190341351 - May; Robert Alan ; et al. | 2019-11-07 |
Systems And Methods For Semiconductor Packages Using Photoimageable Layers
App 20190311916 - CHAVALI; Sri Chaitra ; et al. | 2019-10-10 |
Integrated circuit structures with recessed conductive contacts for package on package
Grant 10,424,561 - Lee , et al. Sept | 2019-09-24 |
Embedded Multi-die Interconnect Bridge Packages With Lithotgraphically Formed Bumps And Methods Of Assembling Same
App 20190198445 - Alur; Amruthavalli Pallavi ; et al. | 2019-06-27 |
Acousto-optics deflector and mirror for laser beam steering
Grant 10,286,488 - Zhang , et al. | 2019-05-14 |
Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
Grant 10,163,798 - Alur , et al. Dec | 2018-12-25 |
Integrated Circuit Structures With Recessed Conductive Contacts For Package On Package
App 20180226381 - LEE; KYU-OH ; et al. | 2018-08-09 |
Package with passivated interconnects
Grant 10,043,740 - Boyapati , et al. August 7, 2 | 2018-08-07 |
Architecture for seamless integrated display system
Grant 9,952,823 - Swan , et al. April 24, 2 | 2018-04-24 |
Package With Passivated Interconnects
App 20180019197 - BOYAPATI; SRI RANGA SAI ; et al. | 2018-01-18 |
Integrated circuit structures with recessed conductive contacts for package on package
Grant 9,865,568 - Lee , et al. January 9, 2 | 2018-01-09 |
High density interconnection of microelectronic devices
Grant 9,842,832 - Karhade , et al. December 12, 2 | 2017-12-12 |
Process for forming a semiconductor device substrate
Grant 9,820,390 - Roy , et al. November 14, 2 | 2017-11-14 |
Laser Via Drilling Apparatus And Methods
App 20170285351 - Salama; Islam A. ; et al. | 2017-10-05 |
Integrated Circuit Structures With Recessed Conductive Contacts For Package On Package
App 20170207196 - LEE; KYU-OH ; et al. | 2017-07-20 |
Integrated Circuit Structures With Interposers Having Recesses
App 20170170109 - LEE; KYU-OH ; et al. | 2017-06-15 |
Laser Via Drilling Apparatus And Methods
App 20170131556 - Salama; Islam A. ; et al. | 2017-05-11 |
Acousto-optics Deflector And Mirror For Laser Beam Steering
App 20170036301 - Zhang; Chong ; et al. | 2017-02-09 |
Methods of forming sensor integrated packages and structures formed thereby
Grant 9,505,607 - Lee , et al. November 29, 2 | 2016-11-29 |
High Density Interconnection Of Microelectronic Devices
App 20160300824 - Karhade; Omkar G. ; et al. | 2016-10-13 |
Method Of Providing A Printed Circuit Board Using Laser Assisted Metallization And Patterning Of A Microelectronic Substrate
App 20160302307 - Salama; Islam A. | 2016-10-13 |
Methods Of Forming Sensor Integrated Packages And Structures Formed Thereby
App 20160280535 - Lee; Kyu Oh ; et al. | 2016-09-29 |
Architecture For Seamless Integrated Display System
App 20160274857 - Swan; Johanna M. ; et al. | 2016-09-22 |
Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrate
Grant 9,442,286 - Li , et al. September 13, 2 | 2016-09-13 |
High density interconnection of microelectronic devices
Grant 9,397,071 - Karhade , et al. July 19, 2 | 2016-07-19 |
Architecture for seamless integrated display system
Grant 9,361,059 - Swan , et al. June 7, 2 | 2016-06-07 |
Device packaging with substrates having embedded lines and metal defined pads
Grant 9,355,952 - Hlad , et al. May 31, 2 | 2016-05-31 |
Chip package incorporating interfacial adhesion through conductor sputtering
Grant 9,331,017 - Wu , et al. May 3, 2 | 2016-05-03 |
Laser via drilling apparatus and methods
Grant 9,211,609 - Salama , et al. December 15, 2 | 2015-12-15 |
Laser cavity formation for embedded dies or components in substrate build-up layers
Grant 9,202,803 - Zhang , et al. December 1, 2 | 2015-12-01 |
Acousto-optic Deflector With Multiple Transducers For Optical Beam Steering
App 20150338718 - ZHANG; Chong ; et al. | 2015-11-26 |
Device Packaging With Substrates Having Embedded Lines And Metal Defined Pads
App 20150318238 - HLAD; Mark S. ; et al. | 2015-11-05 |
Laser Cavity Formation For Embedded Dies Or Components In Substrate Build-up Layers
App 20150279817 - ZHANG; Chong ; et al. | 2015-10-01 |
Package substrate with high density interconnect design to capture conductive features on embedded die
Grant 9,119,313 - Zhang , et al. August 25, 2 | 2015-08-25 |
Device packaging with substrates having embedded lines and metal defined pads
Grant 9,093,313 - Hlad , et al. July 28, 2 | 2015-07-28 |
Optical device and method of making
Grant 9,064,798 - Quick , et al. June 23, 2 | 2015-06-23 |
High Density Interconnection Of Microelectronic Devices
App 20150163904 - Karhade; Omkar G. ; et al. | 2015-06-11 |
Hybrid-core Through Holes And Vias
App 20150089806 - ROY; MIHIR K. ; et al. | 2015-04-02 |
Fabrication Of A Substrate With An Embedded Die Using Projection Patterning And Associated Package Configurations
App 20150048515 - Zhang; Chong ; et al. | 2015-02-19 |
Chip Package Incorporating Interfacial Adhesion Through Conductor Sputtering
App 20150021778 - Wu; Tao ; et al. | 2015-01-22 |
Package Assembly Configurations For Multiple Dies And Associated Techniques
App 20150014852 - Liu; Yueli ; et al. | 2015-01-15 |
Device Packaging With Substrates Having Embedded Lines And Metal Defined Pads
App 20150008578 - Hlad; Mark S. ; et al. | 2015-01-08 |
Optical device and method of making
Grant 8,912,549 - Quick , et al. December 16, 2 | 2014-12-16 |
Package Substrate With High Density Interconnect Design To Capture Conductive Features On Embedded Die
App 20140321091 - Zhang; Chong ; et al. | 2014-10-30 |
Chip package incorporating interfacial adhesion through conductor sputtering
Grant 8,871,634 - Wu , et al. October 28, 2 | 2014-10-28 |
Device packaging with substrates having embedded lines and metal defined pads
Grant 8,835,217 - Hlad , et al. September 16, 2 | 2014-09-16 |
Configuration Of Acousto-optic Deflectors For Laser Beam Scanning
App 20140204454 - Li; Yonggang ; et al. | 2014-07-24 |
Consumer Electronics With An Invisible Appearance
App 20140168263 - AVCI; UYGAR E. ; et al. | 2014-06-19 |
Architecture For Seamless Integrated Display System
App 20140168032 - Swan; Johanna ; et al. | 2014-06-19 |
Chip Package Incorporating Interfacial Adhesion Through Conductor Sputtering
App 20140061927 - Wu; Tao ; et al. | 2014-03-06 |
Substrate Cores For Laser Through Hole Formation
App 20140004361 - Sharma; Nikhil ; et al. | 2014-01-02 |
Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor
Grant 8,618,593 - Salama , et al. December 31, 2 | 2013-12-31 |
Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor
Grant 08618593 - | 2013-12-31 |
Through mold via polymer block package
Grant 8,450,857 - Roy , et al. May 28, 2 | 2013-05-28 |
Through Mold Via Polymer Block Package
App 20120299179 - Roy; Mihir K. ; et al. | 2012-11-29 |
Through mold via polymer block package
Grant 8,278,214 - Roy , et al. October 2, 2 | 2012-10-02 |
Device Packaging With Substrates Having Embedded Lines And Metal Defined Pads
App 20120161330 - Hlad; Mark S. ; et al. | 2012-06-28 |
Embedded semiconductor component
Grant 8,080,836 - Quick , et al. December 20, 2 | 2011-12-20 |
Low Temperature Deposition And Ultra Fast Annealing Of Integrated Circuit Thin Film Capacitor
App 20110304018 - Salama; Islam A. ; et al. | 2011-12-15 |
Optical device and method of making
App 20110211249 - Quick; Nathaniel R. ; et al. | 2011-09-01 |
Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor
Grant 8,003,479 - Salama , et al. August 23, 2 | 2011-08-23 |
Systems and methods to laminate passives onto substrate
Grant 7,981,758 - Seh , et al. July 19, 2 | 2011-07-19 |
Through Mold Via Polymer Block Package
App 20110147929 - Roy; Mihir K. ; et al. | 2011-06-23 |
Optical device and method of making
Grant 7,951,632 - Quick , et al. May 31, 2 | 2011-05-31 |
Method Of Enabling Selective Area Plating On A Substrate
App 20110123725 - Bchir; Omar J. ; et al. | 2011-05-26 |
Method of enabling selective area plating on a substrate
Grant 7,923,059 - Bchir , et al. April 12, 2 | 2011-04-12 |
Systems And Methods To Laminate Passives Onto Substrate
App 20110034002 - Seh; Huankiat ; et al. | 2011-02-10 |
Systems and methods to laminate passives onto substrate
Grant 7,838,419 - Seh , et al. November 23, 2 | 2010-11-23 |
Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate
Grant 7,765,691 - Salama August 3, 2 | 2010-08-03 |
Routing Layer For A Microelectronic Device, Microelectronic Package Containing Same, And Method Of Forming A Multi-thickness Conductor In Same For A Microelectronic Device
App 20090152743 - JOMAA; Houssam ; et al. | 2009-06-18 |
Method Of Enabling Selective Area Plating On A Substrate
App 20090081381 - Bchir; Omar ; et al. | 2009-03-26 |
Method Of Removing Unwanted Plated Or Conductive Material From A Substrate, And Method Of Enabling Metallization Of A Substrate Using Same
App 20090047783 - Bchir; Omar J. ; et al. | 2009-02-19 |
Polymer-based Integrated Thin Film Capacitors, Packages Containing Same And Methods Related Thereto
App 20080145622 - Roy; Mihir K. ; et al. | 2008-06-19 |
Embedded semiconductor component
App 20080017896 - Quick; Nathaniel R. ; et al. | 2008-01-24 |
Low Temperature Deposition And Ultra Fast Annealing Of Integrated Circuit Thin Film Capacitor
App 20070222030 - Salama; Islam A. ; et al. | 2007-09-27 |
Process for fabricating semiconductor component
Grant 7,268,063 - Quick , et al. September 11, 2 | 2007-09-11 |
Method of providing a printed circuit board using laser assisted metallization and patterning of a microelectronic substrate
Grant 7,237,334 - Salama July 3, 2 | 2007-07-03 |
Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate
App 20070144769 - Salama; Islam A. | 2007-06-28 |
Laser via drilling apparatus and methods
App 20070145024 - Salama; Islam A. ; et al. | 2007-06-28 |
Method of making a substrate using laser assisted metallization and patterning with electroless plating without electrolytic plating
App 20070148420 - Salama; Islam A. ; et al. | 2007-06-28 |
System and method for advanced solder bumping using a disposable mask
App 20070145104 - Pang; Mengzhi ; et al. | 2007-06-28 |
Pattern ablation using laser patterning
App 20070000884 - Salama; Islam A. | 2007-01-04 |
Microelectronic inductor with high inductance magnetic core
App 20060267718 - Salama; Islam A. ; et al. | 2006-11-30 |
IC package with prefabricated film capacitor
App 20060220167 - Min; Yongki ; et al. | 2006-10-05 |
Laser metallization for ceramic device
App 20060000641 - Salama; Islam A. ; et al. | 2006-01-05 |
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