Sakuraba; Masami

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sakuraba; Masami.The latest application filed is for "electro-conductive paste for forming an electrode of a solar cell device, a solar cell device and method for producing the solar cell device".

Company Profile

0.9.3

Sakuraba; Masami - Konosu JP
Sakuraba; Masami - Konosu-shi JP
Sakuraba, Masami - Fukuoka-shi JP
Sakuraba; Masami - Tokyo JP
Sakuraba; Masami - Shiojiri JP
Sakuraba; Masami - Kyoto JP
Sakuraba; Masami - Nagaokakyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electro-conductive paste for forming an electrode of a solar cell device, a solar cell device and method for producing the solar cell device Grant 9,461,188 - Nakayama , et al. October 4, 2	2016-10-04
Electro-Conductive Paste for Forming an Electrode of a Solar Cell Device, a Solar Cell Device and Method for Producing the Solar Cell Device App 20150020880 - Nakayama; Masashi ; et al.	2015-01-22
Electro-conductive paste for forming an electrode of a solar cell device, a solar cell device and method for producing the solar cell device Grant 8,852,465 - Nakayama , et al. October 7, 2	2014-10-07
Electro-Conductive Paste for Forming an Electrode of a Solar Cell Device, a Solar Cell Device and Method for Producing the Solar Cell Device App 20110192457 - Nakayama; Masashi ; et al.	2011-08-11
Process for producing ceramic circuit boards App 20040069528 - Sakuraba, Masami ; et al.	2004-04-15
Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method Grant 6,221,511 - Sakuraba , et al. April 24, 2	2001-04-24
Metal-ceramic composite substrate Grant 6,071,592 - Sakuraba , et al. June 6, 2	2000-06-06
Semiconductor substrates of high reliability ceramic metal composites Grant 6,054,762 - Sakuraba , et al. April 25, 2	2000-04-25
Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material Grant 5,965,193 - Ning , et al. October 12, 1	1999-10-12
Copper conductor composition Grant 4,937,016 - Suehiro , et al. June 26, 1	1990-06-26
Copper conductor composition Grant 4,906,404 - Suehiro , et al. March 6, 1	1990-03-06

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