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name:-0.0086901187896729
name:-0.00090789794921875
Sakuma; Mikio Patent Filings

Sakuma; Mikio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sakuma; Mikio.The latest application filed is for "wafer observation position designating apparatus and wafer display position designating method".

Company Profile
0.9.3
  • Sakuma; Mikio - Mitaka JP
  • Sakuma; Mikio - Ichinomiya JP
  • Sakuma, Mikio - Tokyo JP
  • Sakuma, Mikio - Ichinomiya-shi JP
  • Sakuma; Mikio - Aichi-ken JP
  • Sakuma; Mikio - Nagoya JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wafer surface observation apparatus
Grant 7,565,002 - Yasutomi , et al. July 21, 2
2009-07-21
Inkjet head
Grant 7,156,501 - Hirota , et al. January 2, 2
2007-01-02
Wafer observation position designating apparatus and wafer display position designating method
App 20050105790 - Yasutomi, Hiroyuki ;   et al.
2005-05-19
Inkjet head
App 20050036008 - Hirota, Atsushi ;   et al.
2005-02-17
Inkjet head having a plurality of pressure chambers
Grant 6,783,214 - Sakuma August 31, 2
2004-08-31
Inkjet head for inkjet printing apparatus
App 20030103117 - Sakuma, Mikio
2003-06-05
Printing tape cassette with separated recording medium and ink ribbon
Grant 5,685,654 - Nagao , et al. November 11, 1
1997-11-11
Ink ejection device with ink saving mode used when remaining ink amount is small
Grant 5,663,750 - Sakuma September 2, 1
1997-09-02
Ink ejecting printer having different cleaning timings
Grant 5,565,898 - Sakuma October 15, 1
1996-10-15
Tape feed mechanism having ribbon inked surface directed toward ribbon spool
Grant 5,419,648 - Nagao , et al. May 30, 1
1995-05-30
Tape end processing unit
Grant 5,271,789 - Takagi , et al. December 21, 1
1993-12-21
Tape feed cassette with tape cutter and guide
Grant 5,188,469 - Nagao , et al. * February 23, 1
1993-02-23

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