loadpatents
Patent applications and USPTO patent grants for Sakuma; Mikio.The latest application filed is for "wafer observation position designating apparatus and wafer display position designating method".
Patent | Date |
---|---|
Wafer surface observation apparatus Grant 7,565,002 - Yasutomi , et al. July 21, 2 | 2009-07-21 |
Inkjet head Grant 7,156,501 - Hirota , et al. January 2, 2 | 2007-01-02 |
Wafer observation position designating apparatus and wafer display position designating method App 20050105790 - Yasutomi, Hiroyuki ;   et al. | 2005-05-19 |
Inkjet head App 20050036008 - Hirota, Atsushi ;   et al. | 2005-02-17 |
Inkjet head having a plurality of pressure chambers Grant 6,783,214 - Sakuma August 31, 2 | 2004-08-31 |
Inkjet head for inkjet printing apparatus App 20030103117 - Sakuma, Mikio | 2003-06-05 |
Printing tape cassette with separated recording medium and ink ribbon Grant 5,685,654 - Nagao , et al. November 11, 1 | 1997-11-11 |
Ink ejection device with ink saving mode used when remaining ink amount is small Grant 5,663,750 - Sakuma September 2, 1 | 1997-09-02 |
Ink ejecting printer having different cleaning timings Grant 5,565,898 - Sakuma October 15, 1 | 1996-10-15 |
Tape feed mechanism having ribbon inked surface directed toward ribbon spool Grant 5,419,648 - Nagao , et al. May 30, 1 | 1995-05-30 |
Tape end processing unit Grant 5,271,789 - Takagi , et al. December 21, 1 | 1993-12-21 |
Tape feed cassette with tape cutter and guide Grant 5,188,469 - Nagao , et al. * February 23, 1 | 1993-02-23 |
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