Sakazaki; Tetsuya
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sakazaki; Tetsuya.The latest application filed is for "dynamically adjusted purge timing in wet atomic layer etching".
- Sakazaki; Tetsuya - Koshi City JP
- Sakazaki; Tetsuya - Koshi-shi JP
- Sakazaki; Tetsuya - Koshi JP
- SAKAZAKI; Tetsuya - Kumamoto JP
- Sakazaki; Tetsuya - Nirasaki N/A JP
- SAKAZAKI; Tetsuya - Nirasaki City JP
| Patent | Date |
|---|---|
| Dynamically Adjusted Purge Timing In Wet Atomic Layer Etching App 20220254646 - Faguet; Jacques ; et al. | 2022-08-11 |
| Substrate Processing Device And Etching Liquid App 20220213382 - Hiroshiro; Koukichi ; et al. | 2022-07-07 |
| Substrate processing method, substrate processing device and etching liquid Grant 11,306,249 - Hiroshiro , et al. April 19, 2 | 2022-04-19 |
| Substrate Processing Apparatus, Substrate Processing Method, And Chemical Liquid App 20210233780 - SAKAZAKI; Tetsuya ; et al. | 2021-07-29 |
| Substrate Processing Method, Substrate Processing Device And Etching Liquid App 20210032537 - Hiroshiro; Koukichi ; et al. | 2021-02-04 |
| Liquid processing method, liquid processing apparatus and storage medium Grant 9,111,967 - Sekiguchi , et al. August 18, 2 | 2015-08-18 |
| Liquid Processing Method, Liquid Processing Apparatus And Storage Medium App 20120260949 - SEKIGUCHI; Kenji ; et al. | 2012-10-18 |
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