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name:-0.0099039077758789
name:-0.0069990158081055
name:-0.00058388710021973
Sakaue; Hiroyuki Patent Filings

Sakaue; Hiroyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sakaue; Hiroyuki.The latest application filed is for "low dielectric constant films and manufacturing method thereof, as well as electronic parts using the same".

Company Profile
0.4.6
  • Sakaue; Hiroyuki - Higashi-Hiroshima JP
  • Sakaue; Hiroyuki - Higashi-Hiroshima city JP
  • Sakaue; Hiroyuki - Hiroshima JP
  • Sakaue, Hiroyuki - Higashi-Hiroshima-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Low dielectric constant films and manufacturing method thereof, as well as electronic parts using the same
Grant 8,158,536 - Sakurai , et al. April 17, 2
2012-04-17
Low dielectric constant films and manufacturing method thereof, as well as electronic parts using the same
App 20100237476 - Sakurai; Toshio ;   et al.
2010-09-23
Low dielectric constant films and manufacturing method thereof, as well as electronic parts using the same
Grant 7,749,920 - Sakurai , et al. July 6, 2
2010-07-06
Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic components
App 20090283013 - Takahagi; Takayuki ;   et al.
2009-11-19
Semiconductor device fabrication method and fabrication apparatus
Grant 7,371,694 - Sasaki , et al. May 13, 2
2008-05-13
Liquid composition, manufacturing method thereof, low dielectric constant films, abrasive materials, and electronic components
App 20070107317 - Takahagi; Takayuki ;   et al.
2007-05-17
Low-dielectric films, and manufacturion method thereof, and electronic component using it
App 20060244034 - Sakurai; Toshio ;   et al.
2006-11-02
Semiconductor device fabrication method and fabrication apparatus
App 20050186804 - Sasaki, Ken ;   et al.
2005-08-25
Electroless plating process, and embedded wire and forming process thereof
Grant 6,852,624 - Shingubara , et al. February 8, 2
2005-02-08
Electroless plating process, and embedded wire and forming process thereof
App 20030068887 - Shingubara, Shoso ;   et al.
2003-04-10

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