loadpatents
name:-0.013514041900635
name:-0.0059390068054199
name:-0.0006248950958252
Sakata; Ken Patent Filings

Sakata; Ken

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sakata; Ken.The latest application filed is for "cof flexible printed wiring board and semiconductor device".

Company Profile
0.4.10
  • Sakata; Ken - Shimonoseki-shi JP
  • Sakata; Ken - Tokyo JP
  • Sakata; Ken - Shimonoseki JP
  • Sakata; Ken - Shinagawa-ku JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Cof Flexible Printed Wiring Board And Semiconductor Device
App 20080251947 - Sakata; Ken ;   et al.
2008-10-16
Process For Producing A Printed Wiring Board
App 20080171138 - Sakata; Ken ;   et al.
2008-07-17
Mold release layer transferring film and laminate film
Grant 7,255,919 - Sakata , et al. August 14, 2
2007-08-14
Method of producing a COF flexible printed wiring board
Grant 7,198,989 - Sakata , et al. April 3, 2
2007-04-03
COF flexible printed wiring board and method of producing the wiring board
Grant 7,173,322 - Sakata , et al. February 6, 2
2007-02-06
Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device
App 20060213684 - Sakata; Ken
2006-09-28
Flexible printed wiring board, method for fabricating flexible printed wiring board, and semiconductor device
App 20060214282 - Sakata; Ken
2006-09-28
Printed wiring board, production process thereof and semiconductor device
App 20050274689 - Sakata, Ken ;   et al.
2005-12-15
COF flexible printed wiring board and semiconductor device
App 20050205972 - Sakata, Ken ;   et al.
2005-09-22
Method of producing a COF flexible printed wiring board
App 20050181541 - Sakata, Ken ;   et al.
2005-08-18
Mold release layer transferring film and laminate film
App 20050167818 - Sakata, Ken ;   et al.
2005-08-04
Flexible printed wiring board with semiconductor chip and releasing layer
Grant 6,900,989 - Sakata May 31, 2
2005-05-31
COF flexible printed wiring board and method of producing the wiring board
App 20040004823 - Sakata, Ken ;   et al.
2004-01-08
Printed circuit board and method of producing the same
App 20030179552 - Sakata, Ken
2003-09-25

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