SAKAMOTO; YOSHITSUGU
Patent Applications and Registrations
Patent applications and USPTO patent grants for SAKAMOTO; YOSHITSUGU.The latest application filed is for "semiconductor device".
- SAKAMOTO; YOSHITSUGU - Kariya-city JP
- Sakamoto; Yoshitsugu - Toyohashi JP
- Sakamoto; Yoshitsugu - Aichi JP
- Sakamoto; Yoshitsugu - Kariya JP
- Sakamoto; Yoshitsugu - Kariya-shi JP
- Sakamoto; Yoshitsugu - Toyohashi-shi JP
- Sakamoto; Yoshitsugu - Aichi-ken JP
- Sakamoto; Yoshitsugu - Toyohashi-city JP
- Sakamoto; Yoshitsugu - Tokyo JP
- Sakamoto; Yoshitsugu - Nabari JP
| Patent | Date |
|---|---|
| Semiconductor Device App 20210233871 - KAIZU; RYOICHI ; et al. | 2021-07-29 |
| Solder preform and a process for its manufacture Grant 10,081,852 - Hirano , et al. September 25, 2 | 2018-09-25 |
| Solder Paste App 20150027589 - Okada; Sakie ; et al. | 2015-01-29 |
| Bonding material for semiconductor devices Grant 8,896,119 - Sakamoto , et al. November 25, 2 | 2014-11-25 |
| Bonding Material for Semiconductor Devices App 20130134591 - Sakamoto; Yoshitsugu ; et al. | 2013-05-30 |
| Brazing method and brazed structure Grant 8,029,918 - Hasegawa , et al. October 4, 2 | 2011-10-04 |
| Solder preform and a process for its manufacture App 20110068149 - Hirano; Naohiko ; et al. | 2011-03-24 |
| Brazing Method And Brazed Structure App 20100273025 - Hasegawa; Tsuyoshi ; et al. | 2010-10-28 |
| Solder preform and electronic component Grant 7,800,230 - Hirano , et al. September 21, 2 | 2010-09-21 |
| Solder preform and a process for its manufacture Grant 7,793,820 - Hirano , et al. September 14, 2 | 2010-09-14 |
| Method for manufacturing semiconductor device having solder layer Grant 7,601,625 - Noritake , et al. October 13, 2 | 2009-10-13 |
| Solder Preform and Electronic Component App 20090236725 - Hirano; Naohiko ; et al. | 2009-09-24 |
| Method for manufacturing mold type semiconductor device Grant 7,468,318 - Hirano , et al. December 23, 2 | 2008-12-23 |
| Solder preform and a process for its manufacture App 20080237301 - Hirano; Naohiko ; et al. | 2008-10-02 |
| Method for manufacturing mold type semiconductor device App 20070158850 - Hirano; Naohiko ; et al. | 2007-07-12 |
| Brazing method and brazed structure App 20070148490 - Hasegawa; Tsuyoshi ; et al. | 2007-06-28 |
| Semiconductor device having metallic plate with groove Grant 7,235,876 - Okumura , et al. June 26, 2 | 2007-06-26 |
| Semiconductor device having metal plates and semiconductor chip Grant 7,215,020 - Nakase , et al. May 8, 2 | 2007-05-08 |
| Mold type semiconductor device Grant 7,193,326 - Hirano , et al. March 20, 2 | 2007-03-20 |
| Semiconductor device having metallic plate with groove App 20070057373 - Okumura; Tomomi ; et al. | 2007-03-15 |
| Method for manufacturing semiconductor device having solder layer App 20050233568 - Noritake, Chikage ; et al. | 2005-10-20 |
| Semiconductor device having metal plates and semiconductor chip App 20050093131 - Nakase, Yoshimi ; et al. | 2005-05-05 |
| Mold type semiconductor device and method for manufacturing the same App 20040256730 - Hirano, Naohiko ; et al. | 2004-12-23 |
| Processing system for charge request data Grant 6,618,708 - Sakamoto , et al. September 9, 2 | 2003-09-09 |
| Brazing method, brazement, method of production of corrosion-resistant heat exchanger, and corrosion-resistant heat exchanger App 20010047861 - Maeda, Akihiro ; et al. | 2001-12-06 |
| Processing system for charge request data Grant 6,185,544 - Sakamoto , et al. February 6, 2 | 2001-02-06 |
| Carbon electrode for secondary cells, a method for making the same, and a nonaqueous electrolyte secondary cell comprising the carbon electrode Grant 6,087,044 - Iwase , et al. July 11, 2 | 2000-07-11 |
| Outer wall structure of a torque converter and others Grant 4,867,641 - Okuno , et al. September 19, 1 | 1989-09-19 |
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