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Patent applications and USPTO patent grants for Sakaki; Yasuhiko.The latest application filed is for "plating apparatus for wafer".
Patent | Date |
---|---|
Plating apparatus and plating method Grant 7,108,776 - Sakaki September 19, 2 | 2006-09-19 |
Cup type plating apparatus Grant 6,991,711 - Sakaki January 31, 2 | 2006-01-31 |
Plating apparatus for wafer Grant 6,875,333 - Sakaki April 5, 2 | 2005-04-05 |
Cup-type plating apparatus and method for plating wafers Grant 6,610,182 - Sakaki August 26, 2 | 2003-08-26 |
Plating apparatus for wafer App 20030153185 - Sakaki, Yasuhiko | 2003-08-14 |
Plating apparatus and plating method App 20030070932 - Sakaki, Yasuhiko | 2003-04-17 |
Cup shaped plating apparatus with a disc shaped stirring device having an opening in the center thereof Grant 6,482,300 - Sakaki November 19, 2 | 2002-11-19 |
Cup type plating apparatus Grant 6,454,918 - Sakaki September 24, 2 | 2002-09-24 |
Cup-type plating apparatus App 20020108850 - Sakaki, Yasuhiko | 2002-08-15 |
Cup type plating apparatus App 20020088708 - Sakaki, Yasuhiko | 2002-07-11 |
Cup - type plating apparatus App 20020066665 - Sakaki, Yasuhiko | 2002-06-06 |
Cup-type plating apparatus and method for plating wafer using the same Grant 6,332,963 - Sakaki , et al. December 25, 2 | 2001-12-25 |
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