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Sakaki; Yasuhiko Patent Filings

Sakaki; Yasuhiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sakaki; Yasuhiko.The latest application filed is for "plating apparatus for wafer".

Company Profile
0.7.5
  • Sakaki; Yasuhiko - Hiratsuka JP
  • Sakaki, Yasuhiko - Hiratsuka-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Plating apparatus and plating method
Grant 7,108,776 - Sakaki September 19, 2
2006-09-19
Cup type plating apparatus
Grant 6,991,711 - Sakaki January 31, 2
2006-01-31
Plating apparatus for wafer
Grant 6,875,333 - Sakaki April 5, 2
2005-04-05
Cup-type plating apparatus and method for plating wafers
Grant 6,610,182 - Sakaki August 26, 2
2003-08-26
Plating apparatus for wafer
App 20030153185 - Sakaki, Yasuhiko
2003-08-14
Plating apparatus and plating method
App 20030070932 - Sakaki, Yasuhiko
2003-04-17
Cup shaped plating apparatus with a disc shaped stirring device having an opening in the center thereof
Grant 6,482,300 - Sakaki November 19, 2
2002-11-19
Cup type plating apparatus
Grant 6,454,918 - Sakaki September 24, 2
2002-09-24
Cup-type plating apparatus
App 20020108850 - Sakaki, Yasuhiko
2002-08-15
Cup type plating apparatus
App 20020088708 - Sakaki, Yasuhiko
2002-07-11
Cup - type plating apparatus
App 20020066665 - Sakaki, Yasuhiko
2002-06-06
Cup-type plating apparatus and method for plating wafer using the same
Grant 6,332,963 - Sakaki , et al. December 25, 2
2001-12-25

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