| Patent | Date |
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Method for manufacturing printed circuit board, printed circuit board, and electronic device
Grant 11,382,209 - Hasegawa , et al. July 5, 2 | 2022-07-05 |
Electronic module, electronic device, manufacturing method for electronic module, and manufacturing method for electronic device
Grant 11,342,259 - Ishiguri , et al. May 24, 2 | 2022-05-24 |
Image pickup module, method for manufacturing image pickup module, and electronic device
Grant 10,980,160 - Hasegawa , et al. April 13, 2 | 2021-04-13 |
Electronic Module, Electronic Device, Manufacturing Method For Electronic Module, And Manufacturing Method For Electronic Device
App 20210074626 - Ishiguri; Shingo ; et al. | 2021-03-11 |
Electronic module, electronic device, manufacturing method for electronic module, and manufacturing method for electronic device
Grant 10,861,785 - Ishiguri , et al. December 8, 2 | 2020-12-08 |
Image Pickup Module, Method For Manufacturing Image Pickup Module, And Electronic Device
App 20200100408 - Hasegawa; Mitsutoshi ; et al. | 2020-03-26 |
Electronic Module, Electronic Device, Manufacturing Method For Electronic Module, And Manufacturing Method For Electronic Device
App 20190385940 - Ishiguri; Shingo ; et al. | 2019-12-19 |
Method For Manufacturing Printed Circuit Board, Printed Circuit Board, And Electronic Device
App 20190342991 - Hasegawa; Mitsutoshi ; et al. | 2019-11-07 |
Printed circuit board and electronic device
Grant 10,398,037 - Minegishi , et al. A | 2019-08-27 |
Method Of Manufacturing Printed Circuit Board, Printed Circuit Board And Electronic Device
App 20180242462 - Minegishi; Kunihiko ; et al. | 2018-08-23 |
Method for recovering precious metal from solution containing precious metal ions, extracting agent or adsorbent used therefor, and back-extracting agent or desorbent
Grant 9,074,264 - Sudo , et al. July 7, 2 | 2015-07-07 |
Method For Recovering Precious Metal From Solution Containing Precious Metal Ions, Extracting Agent Or Adsorbent Used Therefor, And Back-extracting Agent Or Desorbent
App 20130281726 - Suso; Yukinori ; et al. | 2013-10-24 |
Method of forming conductive layer and semiconductor device
Grant 8,273,656 - Sakaki September 25, 2 | 2012-09-25 |
Method Of Forming Conductive Layer And Semiconductor Device
App 20120189781 - Sakaki; Takashi | 2012-07-26 |
Method of forming conductive layer and semiconductor device
Grant 8,173,542 - Sakaki May 8, 2 | 2012-05-08 |
Method Of Forming Conductive Layer And Semiconductor Device
App 20100164122 - Sakaki; Takashi | 2010-07-01 |
Device for pressure bonding an integrated circuit to a printed circuit board
Grant 6,978,534 - Sakaki December 27, 2 | 2005-12-27 |
Device for pressure bonding an integrated circuit to a printed circuit board
App 20030140484 - Sakaki, Takashi | 2003-07-31 |
Electrical connections using deforming compression
Grant 6,015,081 - Okabayashi , et al. January 18, 2 | 2000-01-18 |
Circuit member and electric circuit device with the connecting member
Grant 5,967,804 - Yoshizawa , et al. October 19, 1 | 1999-10-19 |
Low hydrogen overvoltage cathode and process for production thereof
Grant 5,944,966 - Suetsugu , et al. August 31, 1 | 1999-08-31 |
Electrical connecting member
Grant 5,860,818 - Sakaki , et al. January 19, 1 | 1999-01-19 |
Method for forming an electrical circuit member
Grant 5,819,406 - Yoshizawa , et al. October 13, 1 | 1998-10-13 |
Probe method for measuring part to be measured by use thereof and electrical circuit member
Grant 5,606,263 - Yoshizawa , et al. February 25, 1 | 1997-02-25 |
Method of manufacturing electrical connecting member
Grant 5,600,884 - Kondo , et al. February 11, 1 | 1997-02-11 |
Process for preparing electrical connecting member
Grant 5,379,515 - Kondo , et al. January 10, 1 | 1995-01-10 |
Electric circuit apparatus
Grant 5,283,468 - Kondo , et al. February 1, 1 | 1994-02-01 |
Method of producing electrical connection members
Grant 5,216,807 - Yoshizawa , et al. * June 8, 1 | 1993-06-08 |
Electric circuit device having an electric connecting member and electric circuit components
Grant 5,197,892 - Yoshizawa , et al. March 30, 1 | 1993-03-30 |
Process for preparing electrical connecting member
Grant 5,145,552 - Yoshizawa , et al. September 8, 1 | 1992-09-08 |
Process for preparing electrical connecting member
Grant 5,135,606 - Kato , et al. August 4, 1 | 1992-08-04 |
Method of making electric circuit device
Grant 5,058,800 - Yoshizawa , et al. October 22, 1 | 1991-10-22 |
Method of producing electrical connection members
Grant 4,926,549 - Yoshizawa , et al. May 22, 1 | 1990-05-22 |
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