loadpatents
Patent applications and USPTO patent grants for Sakaida; Daryl.The latest application filed is for "accelerometer systems and methods".
Patent | Date |
---|---|
Accelerometer systems and methods Grant 9,229,026 - Stewart , et al. January 5, 2 | 2016-01-05 |
Method for determining leak rate through a bond line of a MEMS device Grant 8,579,502 - Abbink , et al. November 12, 2 | 2013-11-12 |
Accelerometer Systems And Methods App 20120265481 - STEWART; ROBERT E. ;   et al. | 2012-10-18 |
Method For Determining Leak Rate Through A Bond Line Of A Mems Device App 20110271744 - Abbink; Henry C. ;   et al. | 2011-11-10 |
Method for optimizing direct wafer bond line width for reduction of parasitic capacitance in MEMS accelerometers Grant 8,007,166 - Abbink , et al. August 30, 2 | 2011-08-30 |
Method for Optimizing Direct Wafer Bond Line Width for Reduction of Parasitic Capacitance in Mems Accelerometers App 20080184778 - Abbink; Henry C. ;   et al. | 2008-08-07 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.