SAKAI; Takekazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for SAKAI; Takekazu.The latest application filed is for "method for manufacturing solder circuit board, solder circuit board, and method for mounting electronic component".

Company Profile

0.10.13

SAKAI; Takekazu - Tokyo JP
Sakai; Takekazu - Yokohama N/A JP
Sakai; Takekazu - Yokohama-shi JP
Sakai; Takekazu - Minato-ku JP
Sakai, Takekazu - Saitama JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Manufacturing Solder Circuit Board, Solder Circuit Board, And Method For Mounting Electronic Component App 20160219721 - SAKAI; Takekazu	2016-07-28
Method of producing circuit board Grant 9,078,382 - Shoji , et al. July 7, 2	2015-07-07
Apparatus for adhering solder powder and method for adhering solder powder to electronic circuit board Grant 8,752,754 - Shoji , et al. June 17, 2	2014-06-17
Method of producing circuit board Grant 8,661,659 - Shoji , et al. March 4, 2	2014-03-04
Apparatus For Adhering Solder Powder And Method For Adhering Solder Powder To Electronic Circuit Board App 20120292377 - Shoji; Takashi ; et al.	2012-11-22
Production method of solder circuit board Grant 8,123,111 - Shoji , et al. February 28, 2	2012-02-28
Method Of Producing Circuit Board App 20120042511 - Shoji; Takashi ; et al.	2012-02-23
Method Of Producing Circuit Board App 20120042515 - Shoji; Takashi ; et al.	2012-02-23
Method for attachment of solder powder to electronic circuit board and solder-attached electronic circuit board Grant 8,109,432 - Shoji , et al. February 7, 2	2012-02-07
Method for production of electronic circuit board Grant 8,038,051 - Sakai , et al. October 18, 2	2011-10-18
Method of producing conductive circuit board Grant 7,775,417 - Shoji , et al. August 17, 2	2010-08-17
Method Of Producing Conductive Circuit Board App 20100065615 - Shoji; Takashi ; et al.	2010-03-18
Method Of Producing Conductive Circuit Board App 20100038411 - Shoji; Takashi ; et al.	2010-02-18
Method For Forming Solder Layer On Printed-wiring Board And Slurry Discharge Device App 20100009070 - Shoji; Takashi ; et al.	2010-01-14
Production Method Of Solder Circuit Board App 20090261148 - Shoji; Takashi ; et al.	2009-10-22
Production Method Of Solder Circuit Board App 20090056977 - Shoji; Takashi ; et al.	2009-03-05
Method For Attachment Of Solder Powder To Electronic Circuit Board And Soldered Electronic Circuit Board App 20090041990 - Shoji; Takashi ; et al.	2009-02-12
Method for Attachment of Solder Powder to Electronic Circuit Board and Solder-Attached Electronic Circuit Board App 20080173699 - Shoji; Takashi ; et al.	2008-07-24
Method for Production of Electronic Circuit Board App 20070284136 - Sakai; Takekazu ; et al.	2007-12-13
Solder circuit App 20010020744 - Kuramoto, Takeo ; et al.	2001-09-13

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