Sakai; Tadahiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sakai; Tadahiko.The latest application filed is for "connection structure of circuit member, connection method, and connection material".

Company Profile

2.54.47

Sakai; Tadahiko - Osaka JP
Sakai; Tadahiko - Fukuoka N/A JP
Sakai; Tadahiko - Kadoma JP
Sakai; Tadahiko - Fukuoka-ken JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Connection structure of circuit member, connection method, and connection material Grant 9,999,123 - Kishi , et al. June 12, 2	2018-06-12
Electrode joining method, production method of electrode joined structure Grant 9,839,143 - Motomura , et al. December 5, 2	2017-12-05
Component-mounted structure Grant 9,756,728 - Sakai , et al. September 5, 2	2017-09-05
Electronic component mounting method Grant 9,609,760 - Saeki , et al. March 28, 2	2017-03-28
Electronic component-mounted structure, IC card and COF package Grant 9,516,749 - Wada , et al. December 6, 2	2016-12-06
Connection Structure Of Circuit Member, Connection Method, And Connection Material App 20160316554 - KISHI; ARATA ; et al.	2016-10-27
Electronic Component Mounting Structure And Method Of Manufacturing Electronic Component Mounting Structure App 20150373845 - WADA; Yoshiyuki ; et al.	2015-12-24
Component-mounted Structure App 20150208509 - Sakai; Tadahiko ; et al.	2015-07-23
Electronic Component-mounted Structure, Ic Card And Cof Package App 20150163903 - Wada; Yoshiyuki ; et al.	2015-06-11
Connecting method of electronic component Grant 9,015,932 - Sakai , et al. April 28, 2	2015-04-28
Flux for soldering and soldering process Grant 8,960,526 - Maeda , et al. February 24, 2	2015-02-24
Electrode Joining Method, Production Method Of Electrode Joined Structure, And Production System Of Electrode Joined Structure App 20150047185 - Motomura; Koji ; et al.	2015-02-19
Substrate backing device and substrate thermocompression-bonding device Grant 8,851,138 - Maruo , et al. October 7, 2	2014-10-07
Electronic component mounting system and electronic component mounting method Grant 8,817,487 - Motomura , et al. August 26, 2	2014-08-26
Electronic Component Mounting Method, Electronic Component Placement Machine, And Electronic Component Mounting System App 20140231492 - Saeki; Tsubasa ; et al.	2014-08-21
Electronic component mounting structure Grant 8,759,688 - Yoshinaga , et al. June 24, 2	2014-06-24
Electronic Component Mounting Method, Electronic Component Placement Machine, And Electronic Component Mounting System App 20140096379 - Saeki; Tsubasa ; et al.	2014-04-10
Electronic element unit and reinforcing adhesive agent Grant 8,686,299 - Motomura , et al. April 1, 2	2014-04-01
Component built-in circuit substrate and method of producing the same Grant 8,499,998 - Wada , et al. August 6, 2	2013-08-06
Electronic component mounting system and electronic component mounting method Grant 8,434,665 - Motomura , et al. May 7, 2	2013-05-07
Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires Grant 8,367,938 - Sakai February 5, 2	2013-02-05
Semiconductor Device Mounting Method App 20120329182 - Kojio; Teppei ; et al.	2012-12-27
Electronic Component Mounting Method App 20120309133 - Wada; Yoshiyuki ; et al.	2012-12-06
Substrate Receiving Device And Substrate Thermocompression-bonding Device App 20120234496 - Maruo; Hiroki ; et al.	2012-09-20
Components joining method and components joining structure Grant 8,188,605 - Sakai , et al. May 29, 2	2012-05-29
Electronic Element Unit And Reinforcing Adhesive Agent App 20120111617 - Motomura; Koji ; et al.	2012-05-10
Electronic component soldering structure and electronic component soldering method Grant 8,148,253 - Ozono , et al. April 3, 2	2012-04-03
Electronic Component Mounting System And Electronic Component Mounting Method App 20120012645 - Motomura; Koji ; et al.	2012-01-19
Electronic Component Mounting System And Electronic Component Mounting Method App 20120014084 - Motomura; Koji ; et al.	2012-01-19
Resin Application Apparatus And Data Creation Apparatus For Resin Application App 20110315321 - Yoshinaga; Seiichi ; et al.	2011-12-29
Paste for soldering and soldering method using the same Grant 8,083,121 - Maeda , et al. December 27, 2	2011-12-27
Components Joining Method And Components Joining Structure App 20110284265 - Sakai; Tadahiko ; et al.	2011-11-24
Electronic components mounting adhesive and electronic components mounting structure Grant 8,034,447 - Sakai , et al. October 11, 2	2011-10-11
Electronic component mounting method Grant 8,025,205 - Sakai , et al. September 27, 2	2011-09-27
Components joining method and components joining structure Grant 8,018,074 - Sakai , et al. September 13, 2	2011-09-13
Electronic component mounting method and electronic component mounting device Grant 7,966,721 - Wada , et al. June 28, 2	2011-06-28
Electric components connecting method Grant 7,886,432 - Sakai , et al. February 15, 2	2011-02-15
Method For Manufacturing Electronic Component Module App 20100327044 - Sakai; Tadahiko ; et al.	2010-12-30
Method for manufacturing electronic parts module Grant 7,845,074 - Motomura , et al. December 7, 2	2010-12-07
Method for manufacturing electronic parts module Grant 7,841,081 - Motomura , et al. November 30, 2	2010-11-30
Electronic component mounting method Grant 7,797,822 - Sakai , et al. September 21, 2	2010-09-21
Method of mounting electronic components Grant 7,793,413 - Sakai , et al. September 14, 2	2010-09-14
Method Of Bonding Core Wires To Electrodes And Electronic Unit Formed By Bonding Electrodes And Core Wires App 20100200282 - Sakai; Tadahiko	2010-08-12
Component Built-in Circuit Substrate And Method Of Producing The Same App 20100089628 - WADA; Yoshiyuki ; et al.	2010-04-15
Connecting Method Of Electronic Component App 20100018048 - Sakai; Tadahiko ; et al.	2010-01-28
Electronic Component Mounting Structure App 20100000773 - Yoshinaga; Seiichi ; et al.	2010-01-07
Method for soldering electronic component and soldering structure of electronic component Grant 7,632,710 - Sakai , et al. December 15, 2	2009-12-15
Electronic Components Mounting Adhesive And Electronic Components Mounting Structure App 20090291314 - Sakai; Tadahiko ; et al.	2009-11-26
Electronic Component Mounting Method App 20090288767 - Sakai; Tadahiko ; et al.	2009-11-26
Method For Manufacturing Electronic Parts Module App 20090260229 - Motomura; Koji ; et al.	2009-10-22
Method For Manufacturing Electronic Parts Module App 20090260230 - Motomura; Koji ; et al.	2009-10-22
Electric Components Connecting Method App 20090229123 - Sakai; Tadahiko ; et al.	2009-09-17
Method For Soldering Electronic Component And Soldering Structure Of Electronic Component App 20090233117 - Sakai; Tadahiko ; et al.	2009-09-17
Method Of Mounting Electronic Components App 20090205203 - Sakai; Tadahiko ; et al.	2009-08-20
Method of soldering electronic component having solder bumps to substrate Grant 7,568,610 - Sakai , et al. August 4, 2	2009-08-04
Electronic Components Mounting Adhesive, Manufacturing Method Of An Electronic Components Mounting Adhesive, Electronic Components Mounted Structure, And Manufacturing Method Of An Electronic Components Mounted Structure App 20090161328 - Sakai; Tadahiko ; et al.	2009-06-25
Electronic Component Thermo-compression Tool, And Electronic Component Mounting Apparatus And Mounting Method App 20090126188 - Sakai; Tadahiko ; et al.	2009-05-21
Electronic Component Soldering Structure And Electronic Component Soldering Method App 20090075025 - Ozono; Mitsuru ; et al.	2009-03-19
Components Joining Method And Components Joining Structure App 20090047534 - Sakai; Tadahiko ; et al.	2009-02-19
Semiconductor device and method for assembling the same Grant 7,446,423 - Sakai , et al. November 4, 2	2008-11-04
Flux for Soldering and Soldering Process App 20080244900 - Maeda; Tadashi ; et al.	2008-10-09
Paste For Soldering And Soldering Method Using The Same App 20080048009 - Maeda; Tadashi ; et al.	2008-02-28
Solder Paste App 20070278456 - Sakai; Tadahiko ; et al.	2007-12-06
Mounting method of bump-equipped electronic component and mounting structure of the same Grant 7,284,686 - Ishikawa , et al. October 23, 2	2007-10-23
Method of Packaging Electronic Component App 20070221711 - Wada; Yoshiyuki ; et al.	2007-09-27
Electronic component mounting method and electronic component mounting device App 20070175969 - Wada; Yoshiyuki ; et al.	2007-08-02
Semiconductor device and resin binder for assembling semiconductor device Grant 7,071,577 - Wada , et al. July 4, 2	2006-07-04
Solder composition, connecting process with soldering, and connection structure with soldering App 20060043543 - Wada; Yoshiyuki ; et al.	2006-03-02
Solder composition, connecting process with soldering, and connection structure with soldering App 20060043597 - Wada; Yoshiyuki ; et al.	2006-03-02
Method of soldering electronic component having solder bumps to substrate App 20050284921 - Sakai, Tadahiko ; et al.	2005-12-29
Mounting method of bump-equipped electronic component and mounting structure of the same App 20050127141 - Ishikawa, Takatoshi ; et al.	2005-06-16
Semiconductor device and method for assembling the same App 20050116323 - Sakai, Tadahiko ; et al.	2005-06-02
Method of manufacturing semiconductor device Grant 6,852,572 - Haji , et al. February 8, 2	2005-02-08
Semiconductor device, method of manufacturing the device and method of mounting the device Grant 6,797,544 - Sakai , et al. September 28, 2	2004-09-28
Semiconductor device and resin binder for assembling semiconductor device App 20040080047 - Wada, Yoshiyuki ; et al.	2004-04-29
Semiconductor device and semiconductor device assembly Grant 6,617,675 - Sakai , et al. September 9, 2	2003-09-09
Semiconductor device and semiconductor device assembly App 20020084470 - Sakai, Tadahiko ; et al.	2002-07-04
Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive balls Grant 6,390,351 - Kasai , et al. May 21, 2	2002-05-21
Semiconductor device, method of manufacturing the device and mehtod of mounting the device App 20020048906 - Sakai, Tadahiko ; et al.	2002-04-25
Method of manufacturing semiconductor device App 20010018233 - Haji, Hiroshi ; et al.	2001-08-30
Method of mounting bumped electronic components Grant 6,209,196 - Ozono , et al. April 3, 2	2001-04-03
Method of forming solder bump and method of mounting the same Grant 6,189,771 - Maeda , et al. February 20, 2	2001-02-20
Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps Grant 6,179,198 - Eifuku , et al. January 30, 2	2001-01-30
Electronic parts mounting method Grant 6,000,127 - Eifuku , et al. December 14, 1	1999-12-14
Mounting structure of electronic component having bumps Grant 5,962,925 - Eifuku , et al. October 5, 1	1999-10-05
Structure of electronic parts and method of soldering electronic parts to substrate Grant 5,894,984 - Sakai , et al. April 20, 1	1999-04-20
Conductive ball mounting apparatus and mounting method of conductive ball Grant 5,867,260 - Sakai February 2, 1	1999-02-02
Method for forming bump electrode Grant 5,516,032 - Sakemi , et al. May 14, 1	1996-05-14
Printed circuit board Grant 5,428,505 - Sakemi , et al. June 27, 1	1995-06-27

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.